Archives January 2016 - 3D InCites

Success for 3D:  What A Difference a Year Makes

Success for 3D: What A Difference a Year Makes

During the 2015 European 3D TSV Summit, I drove attendees to distraction by asking each presenter what success looked like to them for 3D integration. The resulting responses became a blog post, What Does Success for 3D Integration Look Like? Now, a year later, I decided to revisit the topic by reminding last year’s presenters of their responses, and asking them for an update. As only few of th... »

European 3D Summit: Putting 3D Packaging To Work

European 3D Summit: Putting 3D Packaging To Work

Now that we’ve determined that advanced wafer level packaging — including embedded technologies, fan-out wafer level packaging, and 3D packaging — add value to the devices in which they are implemented, the next step is understanding which option offers the best cost/performance ratio for specific product applications. One of the goals of this year’s European 3D Summit was to bring togethe... »

The European 3D Summit: The Gala Quiz

The European 3D Summit: The Gala Quiz

Hands-down, the best part of last week’s 2016 European 3D Summit was the Gala Dinner at the Chateau Sassenage, and in particular, the Gala Quiz. (I think my co-attendees would agree with me.) I applaud the organizing committee, and in particular Anne-Marie Dutron and Yann Guillou, for coming up with such a great and fun team-building activity to liven up the evening and demonstrate our competiti... »

European 3D Summit: Market Analysts Weigh in on FOWLP,  3D Packaging, and SiP

European 3D Summit: Market Analysts Weigh in on FOWLP, 3D Packaging, and SiP

As it has in year’s past, the 2016 European 3D Summit kicked off with a market briefing. We heard from the usual suspects: Yole Dévéloppement (Rozalia Beica) and TechSearch International Inc. (Linda Bal). Additionally, in a nod to the business-centric tone of the conference, the committee invited Christian Knochenhauer, McKinsey and Company, to present on value creation in the packaging, assem... »

The European 3D Summit: From Roadmaps to Reality

The European 3D Summit: From Roadmaps to Reality

In its fourth edition and with a new name, the European 3D Summit (formerly the European 3D TSV Summit) reflected the shift from R&D to the real business of 3D integration and advanced packaging, and highlighted the significant growth this market space has undergone in the past year. It has also taken a new perspective, as we no longer view fan-out wafer level packaging (FOLWP) and 3D through... »

SPTS sees a Brighter 2016

SPTS sees a Brighter 2016

In contrast to some of the gloomier predictions of the analysts, we think 2016 will be a growth year for our business. In packaging, we see a number of development projects moving into production this year, and a raft of makers adding capability to catch up with the early adopters. The major example will be the growth of fan-out wafer level packaging (FOWLP). After six years of being a niche acti... »

Fraunhofer EMFT: Our Early and Ongoing Work in 3D Integration

Fraunhofer EMFT: Our Early and Ongoing Work in 3D Integration

Fraunhofer has been working on 3D integration for the past three decades, starting in1987 with a consortium of Siemens, AEG, Philips and the Munich institute IFT (now EMFT).  By 1988, we could successfully fabricate 3D CMOS devices based on recrystallization of deposited poly-Si. In the mid-1990s, we developed a complete process flow for “Through-Si Via technology (TSV) in close cooperation ... »

Combining Technology Platforms and Integrating Complex Materials for New Applications

Combining Technology Platforms and Integrating Complex Materials for New Applications

Heterogeneous integration is in many ways different from other research technology platforms. For one thing, the technology is mostly driven by specific customer needs and hence extremely difficult to anticipate. For some applications, we need to build, on top of CMOS, various sensors, filters, fluidic channels or photonics circuits. For certain other applications, we sometimes even use exotic sub... »

SET joins IRT Nanoelec 3D Integration Program

SET joins IRT Nanoelec 3D Integration Program

SAINT-JEOIRE, France – Jan. 15, 2016 – SET, Smart Equipment Technology, the leading supplier in high-accuracy die-to-die and die-to-wafer bonders, today announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies, using direct copper-to... »

Deca Technologies Sees Promise in FOWLP for 2016

Deca Technologies Sees Promise in FOWLP for 2016

According to TechSearch International, we can expect to see 87% CAGR for fan-out wafer-level packages (FOWLP) over the coming 3 years. This demand is driven by a combination of several factors. Primarily there is great potential for the advanced capabilities of FOWLP to provide cost-effective system-level solutions for mid- to high-pin-count components by addressing the size and performance requir... »

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