Archives December 2015 - 3D InCites

‘Tis the Season for the 3D ASIP Multi-Die IC Design Tutorial

‘Tis the Season for the 3D ASIP Multi-Die IC Design Tutorial

While the shopping malls and specialty stores in and around San Francisco were packed with people hunting for Holiday presents, a very dedicated crowd of 3D IC developers and users from all over the world got together near San Francisco, for the 12th 3D ASIP conference, which featured, once again, the multi-die IC Design Tutorial. Conference presenters reviewed the progress made in 2015 and discus... »

Panel-level Packaging: a Promising Market

Panel-level Packaging: a Promising Market

 For many years now, the semiconductor industry development has been governed by  Moore’s law and the increasing demand for higher performance and lower manufacturing costs. Under this context, the “More than Moore” company, Yole Développement (Yole) has identified a strong interest for panel-level packaging technologies. “At Yole, we saw a growing enthusiasm for panel package solutions... »

At 3D ASIP 2015, Variety is the Spice of Life

At 3D ASIP 2015, Variety is the Spice of Life

Staying relevant in the ever-expanding technology landscape that is the semiconductor packaging industry can be a struggle for an event that’s been laser-focused on one emerging segment since its inception. But this past week, 3D Architectures for Semiconductor Integration and Packaging  (3D ASIP 2015) delivered a program that not only addressed the progress of 3D integration, it also expanded... »

Happy Holidays, from your friends at 3D InCites!

Happy Holidays, from your friends at 3D InCites!

Happy Holidays! »

The Commercialization of 3D Stackable Memory – Part Two

The Commercialization of 3D Stackable Memory – Part Two

The Opportunities for RRAM Cells to Take 3D Stackable Memory to 8-nm Nodes In Part One of this two-part series, we looked at the challenges that need to be overcome in manufacturing 3D stackable memory using the competing technology approaches. We will now focus on the advantages inherent in resistive memory technology over current NAND technology in taking 3D memory on a familiar and reasonable ... »

The MEMS Supply Chain: Through the Looking Glass at IDTechEx 2015

The MEMS Supply Chain: Through the Looking Glass at IDTechEx 2015

What is the MEMS supply chain as we know it going to do, device makers and equipment suppliers both, if paper becomes the next MEMS/sensor substrate? And why are we interested? Dr. Alissa M. Fitzgerald, A.M. Fitzgerald & Associates, gave what was probably the single most talked-about presentation at the recent MEMS Executive Congress in Napa, CA. In “Emerging MEMS & Sensor Technologies t... »

The Commercialization of 3D Stackable Memory: Part One

The Commercialization of 3D Stackable Memory: Part One

The Challenges of Manufacturing 3D Stackable Memory Memory technologies vying to fulfill the increasing capacity and density requirements of the solid-state storage market two years from now will be confronted by having to meet demanding cell performance and cost-per-bit metrics to be viable. Today, NAND technology is still the primary solution for building solid-state storage devices (SSD), as th... »

SEMI Foundation Appoints Leslie Tugman as Executive Director

SEMI Foundation Appoints Leslie Tugman as Executive Director

SEMI Foundation, a nonprofit affiliate of SEMI established to support education and career awareness in the field of high-tech, has announced the appointment of Leslie Tugman as its executive director. SEMI Foundation is known for its flagship program, SEMI High Tech U, which serves high school students interested in pursuing careers in science, technology, engineering and math. Plans are underway... »

With the Potential to Save Lives, Smart Rock Bolt Takes Home the IPSO CHALLENGE 2015 Grand Prize

With the Potential to Save Lives, Smart Rock Bolt Takes Home the IPSO CHALLENGE 2015 Grand Prize

Now in its third year, the IPSO CHALLENGE 2015, an annual event run by the IPSO Alliance, requires entrants to showcase how they use Internet Protocol (IP) and open standards in building devices for the the Internet of Things (IoT). This year’s entries came from around the world in a wide range of industry categories. Semi-finalists ranged from IoT platforms to a host of smart objects. Up agains... »

Mobile Sector Dominates the Advanced Packaging Market as IoT Looms on the Horizon

Mobile Sector Dominates the Advanced Packaging Market as IoT Looms on the Horizon

“Advanced packaging will reach 44% of packaging services and a revenue of US$ 30 billion by 2020,” announces Yole Développement (Yole). Overall, the main advanced packaging market is the mobile sector with end products such as smartphones and tablets. Other high volume applications include servers, PC, game stations, external HDD/USB and more… According to Yole’s latest advanced packaging... »

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