Archives October 2015 - Page 2 of 2 - 3D InCites

Congratulations, Kailash Raman, Winner of the 2015 3D InCites Awards Scholarship

Congratulations, Kailash Raman, Winner of the 2015 3D InCites Awards Scholarship

I am consistently awed by the youth of today who are choosing to follow an educational and career path in science, technology, engineering, and math (STEM). At an early age, they have set out to achieve a goal that requires immense focus, dedication to their studies, and sometimes sacrifice of extracurricular activities. As adults, these young people will be tasked with shaping our future as the w... »

Could Virtual SoCs built using FOWLP displace Interposers in Consumer Applications?

Could Virtual SoCs built using FOWLP displace Interposers in Consumer Applications?

For quite some time on 3D InCites, we’ve talked about how breaking up SoC designs into specific functions not only offers a lower cost of ownership than continued scaling, but also allows for heterogeneous integration of disparate technologies that are manufactured at their optimal nodes and then stacked on an interposer or in a 3D IC stack. In fact, these designs are finally being implemented i... »

SEMI Northeast Forum: Power Electronics Manufacturing – From Concept to Production

SEMI Northeast Forum: Power Electronics Manufacturing – From Concept to Production

I’m not sure what it is about SEMI events held in the U.S. Northeast, but the last two I attended, ASMC 2015 (Saratoga Springs, NY), and the recent SEMI Northeast Forum on Power Electronics Manufacturing (Albany, NY), both reached full attendance capacity before they went live. Word must be out on the great things happening in New York State. It certainly looks that way in the parking lot at SUN... »

SEMI Arizona Breakfast Forum Tackles the Tough IoT Questions

SEMI Arizona Breakfast Forum Tackles the Tough IoT Questions

Lately, I’ve attended a good number of conference and symposium talks focused on the Internet of Things (IoT). Most of them  talk about innovative technologies that have been developed to enable the IoT, how the IoT will make the world a better place, and what we need to do to get there. While many companies are enthusiastic about the opportunities this developing market will bring, the industr... »

PDN Noise: PDN and Signal

PDN Noise: PDN and Signal

In a previous blog, I discussed a power design network’s (PDN) self and transfer impedances. Self impedance highlights anti-resonances causing a significant increase in the PDN’s impedance. The anti-resonances increase a design’s power, noise, and lessen performance. Transfer impedance shows the change in impedance from one location to another on the PDN structure. The higher transfer i... »

TSV Technology Trends and Fabrication Details: A Short Course

TSV Technology Trends and Fabrication Details: A Short Course

3D/TSV technology has been the subject of intense development over the last 10-15 years. During this time, many process advancements were made and several basic questions were answered regarding when and how TSVs would be integrated. After tremendous progress on the technology side, much of the current focus is on 3D product launches and remaining commercialization issues, primarily cost reduction... »

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