Archives October 2015 - 3D InCites

ASU’s School for the Future of Innovation in Society Creates Strong, Responsible Outcomes

ASU’s School for the Future of Innovation in Society Creates Strong, Responsible Outcomes

Here’s a question I’ve been pondering ever since I started thinking about the Internet of Everything and what it means for future generations. Just because something is technologically feasible, should we build it? Will it really improve our lives? Is it going to benefit the greater good? What impact will it have on the socialization of our youth? Essentially, what will the societal outcomes b... »

Ziptronix and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions

Ziptronix and Fraunhofer IZM-ASSID Collaborate on Development of Low-Cost 3D Integration Solutions

SAN JOSE, Calif. — Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. (NASDAQ:TSRA) (“Tessera” or the “Company”) and the leader in low temperature wafer bonding technology, today announced it has entered into a development agreement with Fraunhofer IZM-ASSID (“Fraunhofer”). The companies will work together to integrate Ziptronix Direct Bo... »

Photolithography Equipment & Materials Market Attracts New Players; Success Not Guaranteed

Photolithography Equipment & Materials Market Attracts New Players; Success Not Guaranteed

“Growing photolithography equipment markets in advanced packaging, MEMS and LEDs are attracting new players; but they have to navigate complex roadmaps …” announces Yole Développement (Yole). The “More than Moore” market research and strategy consulting company confirms its leadership in the silicon manufacturing industry with its new technology & market report entitled “Photolith... »

Business Opportunities in Advanced Packaging Drive Photolithography Equipment Demand

Business Opportunities in Advanced Packaging Drive Photolithography Equipment Demand

Within the photolithography equipment market reaching US$ 150M 2014 (Source: Photolithography Equipment & Materials for Advanced Packaging, MEMS and LED Applications report, June 2015), advanced packaging applications have the strongest growth. Yole Développement (Yole) estimates that more than 40 systems have been installed in 2014, with a compound annual growth rate (CAGR) representing 10% ... »

Trusted Data is at the Heart of Monetizing the IoT

Trusted Data is at the Heart of Monetizing the IoT

While there’s been no end to the discussion of the benefits the Internet of Things will bring to our daily lives, it seems some of the more concerning byproducts –referred to as “unintended consequences” – have been, for the most part, downplayed. Concerns like who owns the data generated by consumer or medical wearable devices? What about data generated by devices in cars? For instance,... »

The More-than-Moore Supply Chain Dream has Become a Reality

The More-than-Moore Supply Chain Dream has Become a Reality

The “More than Moore” revolution has already happened. Semiconductor manufacturing processes are no longer exclusive to the integrated circuit (IC) industry. Today, LEDs, MEMS, and power devices have all integrated semiconductor manufacturing processes. But what is the status of the More-than-Moore supply chain? Yole Développement (Yole) and Serma Technologies (Serma) have partnered to create... »

3D Stacking is Part of Life

3D Stacking is Part of Life

Sitaram Arkalgud, VP 3D technologies, Invensas, provided the entertainment at last week’s IWLPC 2015. As soon as he realized Phil Garrou wasn’t in attendance, he reverted to using the 2.5D terminology, despite the fact that on numerous occasions, I have voiced my disdain for the term, preferring “interposer integration.” Arkulgud responded to my catcalls from the audience with, “I’m mo... »

Interposers, 3D TSVs, and Alternatives: One Size Does Not Fit All

Interposers, 3D TSVs, and Alternatives: One Size Does Not Fit All

Whenever Francoise organizes an event, she always manages to compose a mixture of entertainment, real work and valuable education. This panel was no different. Francoise moderated the IWLPC 2015 Panel Discussion: Interposers, 3D TSVs, and Alternatives: What are the Options and Where do They Fit? featuring Aric Shorey, Corning, Inc.; Thibeault Buisson, Yole Developpement; Hughes Metras, CEA-Leti... »

Chasing the Fan-out Wafer Level Packaging Rabbit at IWLPC 2015

Chasing the Fan-out Wafer Level Packaging Rabbit at IWLPC 2015

Sadly, this year it was the 3D session track that had lots of empty seats at the 2015 International Wafer Level Packaging Conference (IWLPC 2015), which was a bit surprising since 3D is really hitting its stride with so many products in high performance computing on the market. Next door, however, the fan-out wafer level packaging (FOWLP) session was a sold-out show. Both the keynote by GlobalFoun... »

Monolithic 3D Poses New Challenges for Test

Monolithic 3D Poses New Challenges for Test

At last week’s sixth annual IEEE 3D Test Workshop, it was exciting to see the number of presentations that demonstrated solutions to the 3D test challenges that have been plaguing us for so long. Not only that, but these 3D test flows are being used on real 3D integrated devices available on the market such as Xilinx Vertex FPGA product line, SK hynix’ high bandwidth memory (HBM) stacks, and A... »

Page 1 of 212