Archives August 2015 - Page 2 of 2 - 3D InCites

We Few, We Happy Few – Eli Harari and the Golden Thread to System Flash

We Few, We Happy Few – Eli Harari and the Golden Thread to System Flash

An epiphany struck me last week when I attended the Flash Memory Summit in Santa Clara, California. I had come specifically to attend “A Conversation with Eli Harari” which turned out to be an inspiring affair both from a scientific and entrepreneurial viewpoint. As I wandered around the glitz and glam of the shiny exhibits beforehand, the thought hit me that this whole industry is built upon ... »

ABC, easy as 123: Does Alphabet Spell Good News for the Semiconductor Industry?

ABC, easy as 123: Does Alphabet Spell Good News for the Semiconductor Industry?

I’m sure by now you’ve all heard or read about the big news at Google: The creation of Alphabet as a holding company, of which Google is now a subsidiary; along with new spin-out companies that were “wacky projects” under the old business model. (David Goldman, CNNMoney’s words, not mine). You may have even read this Google blog post by Larry Page, CEO Alphabet and Google Co-founder, ex... »

Subscription Renewals:  Can We Move to the 21st Century?

Subscription Renewals: Can We Move to the 21st Century?

If my fitness regimen can be Internet enabled, why can’t my magazine subscription renewals be? We all get them. Some come in emails while most use the phone call approach. You know, the “unrecognizable number” call that has a ‘few’ questions to answer that turns into many minutes of either repeating the information to or from the other speaker. If you do not answer, they continually call... »

Finetech’s Sigma Die Bonder High Accuracy Targets Advanced Wafer Level Packaging Applications

Finetech’s Sigma Die Bonder High Accuracy Targets Advanced Wafer Level Packaging Applications

GILBERT, AZ — August 6, 2015 — Finetech introduces its new FINEPLACER® Sigma bonder, designed to provide a solution for large die up to 100mm, combined with a working area of 450 x 300mm. The FINEPLACER® Sigma is ideally suited for high-density array applications and high bond force (up to 1000N) requirements, coupled with Finetech’s renowned sub-micron placement accuracy. The system is t... »

Samsung 3D Stacked DDR4 DRAM Brings Via-Mid Technology to the Mainstream

Samsung 3D Stacked DDR4 DRAM Brings Via-Mid Technology to the Mainstream

LYON, France – July 31, 2015 – System Plus Consulting, sister company of Yole Développement (Yole), released its new reverse costing report, Samsung 3D TSV stacked DDR4 DRAM. In August 2014 Samsung announced the mass production of the first analyzed 3D TSV technology based DDR4 modules for enterprise servers. According to Samsung, this new module, because of its high density and high performa... »

Improving R&D Efficiency to get “Moore” out of Chips

Improving R&D Efficiency to get “Moore” out of Chips

The semiconductor industry invests more in R&D than any other industry except pharmaceuticals. At the same time, It is dealing with shortening product life cycles. How is the industry expected to continue innovating while still profiting from their R&D investments needed to deliver transitions in main areas such as lithography and wafer sizes? While the microelectronics industry could use ... »

Assembly Design Kits are the Future of Package Design Verification

Assembly Design Kits are the Future of Package Design Verification

Unlike the traditional system-on-chip (SoC) design process, which has fully qualified verification methods embodied in the form of process design kits (PDKs), chip design companies and assembly houses have no integrated circuit (IC) package co-design sign-off verification process to help ensure that an IC package will meet manufacturability and performance requirements. Package die are often produ... »

EV Group Receives 3D InCites Award for Gemini FB XT Automated Fusion Wafer Bonder

EV Group Receives 3D InCites Award for Gemini FB XT Automated Fusion Wafer Bonder

ST. FLORIAN, Austria, July 30, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received a 2015 3D InCites Award for its GEMINI®FB XT automated fusion wafer bonder in the category of 3D manufacturing equipment. Hosted by 3D InCites, an online media resource founded in 2009 to s... »

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