Archives July 2015 - Page 2 of 3 - 3D InCites

Congratulations to the Winners of the 2015 3D InCites Awards

Congratulations to the Winners of the 2015 3D InCites Awards

For the third consecutive year, 3D integration enthusiasts gathered at the Impress Lounge at SEMICON West for the 2015 3D InCites Awards Breakfast, sponsored by Micron, to celebrate innovation in 3D integration and honor those who have contributed significantly to the advancement of innovative processes that enable interposer integration, 3D ICs, monolithic 3D, 3D memory, and 3D heterogeneous inte... »

Equipment Sentinel Fault Detection and Classification Software from Rudolph Technologies Maximizes Value from all Fab Data

Equipment Sentinel Fault Detection and Classification Software from Rudolph Technologies Maximizes Value from all Fab Data

Flanders, New Jersey (July 14, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) today introduced Equipment Sentinel™, a state-of-the-art, automated fault detection and classification (FDC) software solution that seamlessly combines key wafer-level data with high-fidelity tool signal and event data into a single framework, giving users a comprehensive, easy-to-understand view of their processes an... »

Executive Viewpoint: Providing A Golden Boat of Wafers

Executive Viewpoint: Providing A Golden Boat of Wafers

As 3D integration technologies become established in low volume manufacturing, the supply chain is gearing up to address high volume manufacturing challenges so that ultimately, these technologies can be used in consumer products. Cost is king, and industry-wide efforts are focused on lowering it. We talk a lot about optimizing technology on 3D InCites, but we don’t often look at what can be don... »

aveni: The New Name and Face of Alchimer

aveni: The New Name and Face of Alchimer

I’ve been following the Alchimer story as it unfolds ever since I first started following the course of 3D integration in 2009. In my opinion, the technology has been cool and disruptive pretty much since day one. The wet, electrochemical process that enables growth of nanometric films offers an elegant, high yield alternative to traditional deposition processes for metallization. However, findi... »

Alchimer Rebrands as aveni; Enters Technology Commercialization Phase

Alchimer Rebrands as aveni; Enters Technology Commercialization Phase

Company secures $13.5M in funding led by a semiconductor chipmaker and ALIAD; Positioned to revolutionize the copper plating processes at 14nm and below  MASSY, France – July 13, 2015 – Alchimer S.A., a leading provider of metallization technologies for damascene, through silicon vias (TSVs), MEMS and other electronic applications, today announced that the company has been renamed aveni. The... »

Genmark Automation Launches CODEX Stocker;  Industry’s First Integrated Stocker, Sorter and Metrology System

Genmark Automation Launches CODEX Stocker; Industry’s First Integrated Stocker, Sorter and Metrology System

Tool frees up valuable fab floor space for production equipment; allows for internal expansion of manufacturing capacity  Fremont, Calif., July 13, 2015 ­– Genmark Automation, a global leader in tool and factory automation solutions for the semiconductor and related industries, today announced the launch of its new CODEX™ Stocker. The CODEX Stocker integrates stocking, sorting and metrology ... »

Heterointegration, Friend or Foe: Opening the Door for Technologies Beyond Moore’s Law Silicon

Heterointegration, Friend or Foe: Opening the Door for Technologies Beyond Moore’s Law Silicon

What is heterogeneous integration, and is it my friend, or is it my foe? Why does it seem everywhere one looks, heterointegration is standing up and being counted right now, in mid-2015? And what kind of doors is heterogeneous integration opening for microelectronic technologies beyond, complementary to, or in competition with Moore’s Law silicon-based semiconductors? Dr. Peter Ramm, Fraunhofer ... »

IRT Nanoelec Partners Achieve 3D Chip-stacking Technology and 3DNoC Framework for Digital Processing

IRT Nanoelec Partners Achieve 3D Chip-stacking Technology and 3DNoC Framework for Digital Processing

GRENOBLE, France – July 09, 2015 – IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using micro- and nanoelectronics, and its partners CEA-Leti, STMicroelectronics and Mentor Graphics have realized an innovative 3D chip, called “3DNoC” to demonstrate the use of 3D stacking technology in scalable, complex digital systems-on-chip (SoCs).... »

Comparing Two Flavors of Chip Stacking Yield

Comparing Two Flavors of Chip Stacking Yield

One of the ways to build more complex, powerful, and cost-effective electronic systems is stacking chips on top of each other. Imec recently compared the two main options for going 3D: interposer-based stacking and 3D stacking. The goal of the exercise was to detect whether the stacking and packaging processes for the two options result in a different yield, and where in the processes those differ... »

The 2015 3D InCites Guide to 3D at SEMICON West

The 2015 3D InCites Guide to 3D at SEMICON West

2015 will go down in history as the year 3D finally got real. It’s not an emerging technology anymore, and as such isn’t a main feature at the 2015 SEMICON West, which gets underway next week, July 13-16, 2015 at the Moscone Center in San Francisco. Rather, this year 3D topics are integrated throughout the program. With a little digging, I pulled together this year’s guide. Here’s where yo... »

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