Archives July 2015 - 3D InCites

In Conversation with Yann Guillou About the SEMI European MEMS Summit 2015

In Conversation with Yann Guillou About the SEMI European MEMS Summit 2015

Yann Guillou, Membership & Business Development, SEMI Europe, talked with 3D InCites / 3D+ about the upcoming European MEMS Summit 2015, which will be held in Milan, Italy, on 17-18 September. 3D InCites / 3D+: Yann, thank you for taking the time to talk with us today about the European MEMS Summit 2015 SEMI is producing this year in Milan. You have as a theme for the summit Sensing the Planet... »

Cladogenesis: The Clouds Parted Over California to Reveal … IoT, MEMS, FD-SOI, and Heterointegration

Cladogenesis: The Clouds Parted Over California to Reveal … IoT, MEMS, FD-SOI, and Heterointegration

The semiconductor fabrication industry has been wandering in something of a wilderness recently, what with the continued delays in EUV lithography as a production-ready technology, 450mm gone quiet, ‘teenage’ FinFET costs zooming, and the baton in single-digit nanometer FinFET passing from Intel to IBM and its partners. It’s a situation that made SEMICON West 2015 most interesting. There was... »

Taking 3D Integration to the Next Level

Taking 3D Integration to the Next Level

There is no rest for the weary. Just because we can finally declare that 3D ICs are in production doesn’t mean we’re done working on it. To the contrary, efforts are ongoing at research institutes like imec in Belgium and Leti in France to take 3D integration to the next level. imec Driven by what imec’s Luc van den hove called “the intuitive internet of things (I-IOT)” the heat is on to... »

Semiconductor Supplier Updates from SEMICON West 2015

Semiconductor Supplier Updates from SEMICON West 2015

No SEMICON West would be complete without a few laps around Moscone North and South, and some one-on-one chats with suppliers. I stopped in to see several semiconductor supplier companies who annually request an audience with the Queen of 3D to talk about their latest accomplishments, as well as gain some insight on their perspective of the industry. I had my 9th annual briefing with Manish Ranjan... »

At AMD, Die Stacking Hits the Big Time

At AMD, Die Stacking Hits the Big Time

It’s official. Die stacking and interposer integration have been implemented in a high volume consumer application. AMD officially launched the Fiji GPU processor, the first to feature die stacking and high bandwidth (HBM) technology, amidst quite a bit of media fanfare at the E3 gaming conference in Los Angeles and in Beijing on June 16, 2015. This is big, news for the 3D integration community.... »

How 2.5/3D Technologies Will Shake Up the Semiconductor Supply Chain and Cost Structure

How 2.5/3D Technologies Will Shake Up the Semiconductor Supply Chain and Cost Structure

At the 2015 3D InCites Awards Breakfast, which took place July 16, 2015 at the Impress Lounge during SEMICON West, Scott Jones, Director, Alix Partners presented a talk in which he described the positive financial impact interposer and 3D integration will have on the semiconductor manufacturing supply chain. He suggested we think like a fab owner when considering the benefits of implementing in... »

Rudolph Technologies and DISCO Corporation  Partner to Improve Wafer Saw Process

Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process

Flanders, New Jersey (July 14, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software solutions to optimize the wafer saw unit processes. These comprehensive solutions will enable their customers to consistently improve the quality and productivity of their advanced packaging products... »

SEMICON West 2015 Demonstrates the Powerful IC Manufacturing Base

SEMICON West 2015 Demonstrates the Powerful IC Manufacturing Base

A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and their customers focused on how to design the new wave of 10nm chips, this year and next. Last week the Moscone Center was buzzing again, this time with material suppliers, equipment vendors, and IC manufacturing experts, discussing how to ramp up production and improve yi... »

SEMICON West Keynote Panel: Semiconductor Manufacturing is a Team Sport

SEMICON West Keynote Panel: Semiconductor Manufacturing is a Team Sport

I almost didn’t attend the keynote panel titled, Scaling the Walls of Sub 14nm Manufacturing, at SEMICON West last week, because in my experience as a blogger/journalist focused on advanced packaging, interposer integration and 3D ICs, discussions on scaling rarely talk about packaging. In fact, up until now, it’s been an either/or discussion. Either we scale further, OR we look at stacking as... »

The IoT at SEMICON West 2015: We Just Can’t Get Enough

The IoT at SEMICON West 2015: We Just Can’t Get Enough

As a topic of much discussion and debate, the Internet of Things (IoT) stole the show once again, this time at SEMICON West 2015. Between imec’s ITF USA 2015: Builders of Tomorrow event Monday, Bill Bottoms’ presentation on ITRS 2.0 during Tuesday’s STS Advanced Packaging Session The Very Big Picture, and the keynote by Doug Davis, Intel, on The Internet of Things and the Next Fifty Years of... »

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