Archives June 2015 - Page 3 of 3 - 3D InCites

ECTC 2015: From the Tech Sessions Part 2

ECTC 2015: From the Tech Sessions Part 2

As promised in part 1 of my ECTC 2015 blog about this impressive conference, see below summaries of presentations I found very useful to contribute to the advancement of single- and multi-die packaging. To make it easier for the reader to dig deeper and review the entire paper, I included in every summary the paper number, as listed in the program and on the USB stick we received. As I mention in... »

TechSearch International Makes Sense of Package Alphabet Soup

TechSearch International Makes Sense of Package Alphabet Soup

With new packages continuously being introduced, TechSearch International’s latest Advanced Packaging Update focuses on making some sense out of the alphabet soup of package options for split die. Application targets range from high-performance solutions for devices such as FPGAs to application processors found in mobile devices. SLIM, SWIFT, EMIB, NTI, and SLIT are high-density substrates witho... »

1551 Industry Experts Demonstrate at ECTC: IC Packaging Technology is Essential for  Success

1551 Industry Experts Demonstrate at ECTC: IC Packaging Technology is Essential for Success

Last week I attended the record-breaking 65th ECTC in San Diego: 20 percent more attendees, compared to last year’s conference in Orlando. Once again, this year’s event offered a wide range of topics in six tracks. I spent most of my time in the “Advanced Packaging” track and was in good company — most of these sessions were standing room only. ECTC demonstrated very clearly that mor... »

Will the Chip Industry Benefit from the Internet of Everything?

Will the Chip Industry Benefit from the Internet of Everything?

The Internet of Things (IoT)  or as Cisco calls it, the Internet of Everything, has been the theme du jour for almost every semiconductor-related industry event in the past year, and going forward for 2015. The IoT hype continues, as many see the opportunity in this global trend to connect people, processes, data and things that will require 50 billion connected devices by 2020, and will generat... »

Catching Up with Robert Andosca / MicroGen: Agnostic Power to the IoT

Catching Up with Robert Andosca / MicroGen: Agnostic Power to the IoT

3D InCites / 3D+ recently had the opportunity to visit Dr. Robert Andosca, co-founder, president, and CEO of MicroGen Systems, Inc., at MicroGen’s headquarters in the High Tech Rochester Lennox Tech Enterprise Center, just off the Rochester Institute of Technology campus in Henrietta (Rochester), NY. To devotees of film, particularly the 35mm variety, Rochester will be fondly remembered as the h... »

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