Archives June 2015 - Page 2 of 3 - 3D InCites

Amkor: SLIM

Amkor: SLIM

Amkor’s SLIM (siliconless integrated module) is a dies-last package technology providing the thinnest possible form factor with the highest level of integration by use of back-end-of-line technology combined with assembly-based fan-out architectures.  It has optimal registration, 3D access to top and bottom side of package and the finest line RDL capability found in packaging today! Testim... »

Amkor Execs Outline Strategy for the Future of Advanced Packaging

Amkor Execs Outline Strategy for the Future of Advanced Packaging

I was invited to attend Amkor’s bi-annual customer symposium, which was held in Santa Clara two weeks ago. It was a grand event, complete with rock music intros narrated by a disembodied Voice of Authority for the execs (wait, was that AC/DC’s Back in Black I heard as CEO Steve Kelley took the stage?), inspirational TED-talk like presentations, and a motivational keynote about (you guessed it!... »

Xilinx: Ultrascale VU440 3D FPGA

Xilinx: Ultrascale VU440 3D FPGA

The Xilinx Ultrascale VU440 3D FPGA is constructed using “Xinterposer” 3D IC technology jointly developed by Xilinx and TSMC. It uses a low-k dielectric chip fabricated on 20nm silicon node with a total of 375,000 micron bumps stacked on 25mm x 45mm silicon interposer and assembled with CoWoS. The composite 3D FPGA consists of approximately 19 billion transistors. Testimonial: The Ultrasca... »

Executive Viewpoint:  The Impact of Process Control on FOWLP and 3D IC

Executive Viewpoint: The Impact of Process Control on FOWLP and 3D IC

As Si interposer and 3D stacked memory devices enter into production, albeit in low volumes, semiconductor manufacturers are lining up their ducks to be ready for high volume manufacturing (HVM) when it happens. As a result, some suppliers of high volume manufacturing equipment who have been rather quiet through the development phase are now showing their cards. For example, KLA-Tencor recently in... »

Dynaloy: Dynastrip DL9150

Dynaloy: Dynastrip DL9150

The newly released Dynastrip™ DL9150 is a non-TMAH containing multi-purpose photoresist and post-etch residue remover. With outstanding cleaning and metal compatibility, this product raises the bar for achieving environmental, health, and safety compliance while also performing as well as comparable products that contain TMAH. Testimonial: Dynaloy’s new solvent, Dynastrip DL9150, has demonstra... »

Sensors Expo 2015 and The Internet Of Messy Things

Sensors Expo 2015 and The Internet Of Messy Things

What are the implications for the Internet of Things when the “Things” are human beings? As was said in a recent New Yorker piece on exploring Mars, “… humans are the wrong stuff. They shouldn’t even be trying to get to another planet. Not only are they fragile, demanding, and expensive to ship; they’re a mess.” Beyond that, we humans are unreliable; we sometimes don’t take our med... »

Diverse Technology Selections Served at CS MANTECH 2015

Diverse Technology Selections Served at CS MANTECH 2015

What were all these silicon people doing at a compound semiconductor conference? CS MANTECH 2015 was the 30th anniversary version of the conference once known as GaAs MANTECH, and which now goes by the more representative name of Compound Semiconductor Manufacturing Technology Conference, the change made along the way to reflect the diverse technology selections being served at recent conferences,... »

ECTC 2015 Supplier Update

ECTC 2015 Supplier Update

While Herb Reiter dove deep into the technology sessions at ECTC 2015, I spent most of my time picking the brains of suppliers who have introduced products targeting advanced wafer level packaging and 3D ICs. Overall, I’ve noticed efforts are becoming really targeted, and are focused on remaining challenges like thermal management, improving yields, and increasing throughput, addressing a... »

EV Group: GEMINI®FB XT Automated Production Fusion Bonding System

EV Group: GEMINI®FB XT Automated Production Fusion Bonding System

The GEMINI®FB XT fusion wafer bonding platform features up to a 3X improvement in wafer-to-wafer bond alignment accuracy as well as a 50% increase in throughput over the previous industry benchmark platform. These performance breakthroughs clear several key hurdles to the industry’s adoption of 3D-IC/TSV technology. Testimonial According to the ITRS, high-density TSV applications require wa... »

Who Should Win the First 3D InCites Individual Achievement Award?

Who Should Win the First 3D InCites Individual Achievement Award?

The journey to the commercialization of 3D integration technologies has been long – longer than most expected – an arduous. It has required tremendous investment, and it has required the efforts of the entire supply chain. The industry has experienced a paradigm shift in how it conducts business because of it. There has been an increase in communication and collaboration, and the walls... »

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