Archives May 2015 - 3D InCites

ECTC 2015: Advanced Packaging Sets Sail in San Diego

ECTC 2015: Advanced Packaging Sets Sail in San Diego

The 65th annual Electronics Technology Components Conference (ECTC 2015) logged record numbers (over 1500 attendees, 20% increase over last year) as the entire semiconductor industry recognizes (finally) that there is indeed money to be made in the advanced packaging sector. The flip chip and wafer level packaging sessions were full to overflowing. The 3D tech sessions offered lots of fresh conte... »

ASMC 2015: Has the Wonderment of Semiconductors Become a Presumption?

ASMC 2015: Has the Wonderment of Semiconductors Become a Presumption?

The 26th annual SEMI Advanced Semiconductor Manufacturing Conference was held in Saratoga Springs, NY, May 3-6, 2015.  ASMC 2015 drew a record number of attendees to the lovely old town of Saratoga (aka the Queen of Spas), a town which is conveniently situated just miles up the road from GLOBALFOUNDRIES Fab 8 in Malta, NY, and which is just a reasonable drive away from The College of Nanoscale S... »

Strength Through Consolidation in MEMS and Sensors: MIG Adds TSensors Division, Accelerating a World of “Abundance”

Strength Through Consolidation in MEMS and Sensors: MIG Adds TSensors Division, Accelerating a World of “Abundance”

MEMS Industry Group®, the trade association advancing MEMS and sensors across global markets, announced the creation of its new TSensors division on May 14,  2015; headed by Dr. Janusz Bryzek, TSensors Summit, Inc.’s founder. MIG’s new division will extend TSensors Summit’s visionary efforts to accelerate a world in which everyone has access to “Abundance” —food, safe water, clean ai... »

IoT: Beyond the Hype

IoT: Beyond the Hype

All the hype surrounding the Internet of Things has me worried. First of all, its my opinion that the motivation behind the IoT is not necessarily to our benefit. Call me a skeptic, but as I see it, like snake oil, we’re being sold on the notion that the IoT is the cure for everything. I compare it to the Smart Grid, which while more complex and involves more security and bureaucracy than the Io... »

Omnivision: OV23850 PureCel Image Sensor

Omnivision: OV23850 PureCel Image Sensor

OmniVision’s OV23850 PureCel image sensor utilizes the companies advanced stacked die process capture exceptional images and video in 23.8-megapixel resolution while maintaining a compact form factor, which is critical for the next-generation of slim smartphones and tablets. Testimonial OmniVision’s family of PureCel backside-illuminated image sensors use the company’s stacked di... »

Personal Dosimeters, TSMC CMOS Wafer MEMS, DRIE Commercialization: 3 Lessons from MEMS Engineer Forum 2015

Personal Dosimeters, TSMC CMOS Wafer MEMS, DRIE Commercialization: 3 Lessons from MEMS Engineer Forum 2015

The initial shock of a major earthquake lasts just a short time, tens of seconds, although it can seem forever for those trapped by its shaking. A tsunami wave train lasts minutes to hours before ocean waters re-stabilize after their initial disturbance. But the persistence of radiological disasters is measured in decades.  Decades in which the principles of entropy apply to the dispersion of the... »

Spotlight on FOWLP, Monolithic 3D IC and 3D TSVs

Spotlight on FOWLP, Monolithic 3D IC and 3D TSVs

Fan-out wafer level packaging’s star is clearly on the rise as a low-cost solution for consumer mobile products, and the semiconductor industry trade news has been buzzing with unsubstantiated claims that Qualcomm is ditching through silicon vias (TSVs) for monolithic 3D ICs (M3D) in its next generation of cell phones. Meanwhile, it seems 3D TSV technologies have been moved to the back burner un... »

SEMI European MEMS Summit 2015: Linking MEMS Markets, Technologies, Executives, and You

SEMI European MEMS Summit 2015: Linking MEMS Markets, Technologies, Executives, and You

Join us in Milan, Italy, on September 17 and 18, 2015 for a new flagship MEMS event being produced by SEMI Europe. The SEMI European MEMS Summit 2015 expands on SEMI’s long record serving the MEMS device fabrication manufacturing supply chain and, combined with SEMI’s proven track record in microelectronics overall, the Summit will be the high-level event of the year on European soil for exc... »

Scott Jones to Deliver Keynote at 2015 3D InCites Awards Breakfast

Scott Jones to Deliver Keynote at 2015 3D InCites Awards Breakfast

Phoenix AZ – May 8, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced Scott Jones, director, Alix Partners, will deliver a keynote address titled How 2.5/3D Technologies Will Shake Up the Semiconductor Supply Chain and Cost Structure at the third annual 3D InCites Awards Breakfast. Sponsored by Micron, the event takes place July 16, 2... »

SEMICON West 2015 Focuses on the Most Critical Issues in Semiconductor Manufacturing

SEMICON West 2015 Focuses on the Most Critical Issues in Semiconductor Manufacturing

San Jose, CA (May 7, 2015) — SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing. In addition to the exposition, with over 650 exhibitors planned, SEMICON West will feature over 180 total hours of programs — including free technical, applications and business programs as well as an... »

Page 1 of 212