Archives April 2015 - 3D InCites

Japan, Abenomics, IoT, and the MEMS Engineer Forum 2015

Japan, Abenomics, IoT, and the MEMS Engineer Forum 2015

MEMS sensors, and the Internet of Things data they feed to the cloud, are being called on to jumpstart the world’s third largest economy. The economic revitalization strategy being instituted by Japanese Prime Minister Shinzo Abe, and now being carried out in Japan under the moniker “Abenomics,” consists of Three Arrows: the First Arrow is aggressive monetary policy; the Second Arrow is flex... »

What’s In Store for Attendees at ECTC 2015

What’s In Store for Attendees at ECTC 2015

ECTC 2015 returns to my favorite of its three rotating locations at the Sheraton San Diego Hotel and Marina almost exactly one month from now, May 26-29, 2015. This year, the ECTC technical committee has selected 350 papers on topics related to 3D and TSV technologies, wafer level packaging, electrical and mechanical modeling, RF packaging, system design, and optical interconnects. I guarantee t... »

SPTS Technologies Receives Supplier Excellence Award from Analog Devices

SPTS Technologies Receives Supplier Excellence Award from Analog Devices

YAVNE, ISRAEL, April 20 2015 | ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor and related industries, was presented with a Supplier Excellence Award in the ‘Special Achievement’ category at the Analog Devices (NASDAQ: ADI) annual award ceremony held in Hong Kong. The ADI S... »

Dow’s SOLDERON™ Tin-Silver Plating Chemistry Wins Prestigious Bronze Edison Award

Dow’s SOLDERON™ Tin-Silver Plating Chemistry Wins Prestigious Bronze Edison Award

MARLBOROUGH, MA – April 27, 2015 – Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry was honored as a Bronze 2015 Edison Award winner in the Material Science: Manufacturing category. Removing lead from solders used in electronics is a difficult technical challenge because it has unique ... »

EDPS 2015 Looks At IC Innovations from the Design Perspective

EDPS 2015 Looks At IC Innovations from the Design Perspective

On Thursday and Friday of last week, Monterey, California’s previous state capital, became the center of presentations and discussions about IC design challenges as well as latest innovations / progress made in the field of EDA tools and IC design methodologies at Electronic Design Process Symposium (EDPS) 2015. We also learned a lot about FinFETs and FD-SOI during Thursday morning’s keynote... »

Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

Flanders, New Jersey (April 27, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep® Advanced Packaging Lithography System and multiple NSX® Inspection Systems for use in their planned capacity expansion. The tools, which will ship this quarter and next, will be used i... »

Wafer-to-Wafer Bonding Cost Analysis

Wafer-to-Wafer Bonding Cost Analysis

Last year, I did an analysis that included the topic of wafer-to-wafer bonding. Specifically, it was a comparison of the three variations available when stacking wafers and/or die—wafer-to-wafer (W2W), die-to-wafer (D2W), and die-to-die (D2D). The goal of that project was to build cost models for W2W and D2W (with the understanding that D2D had similar cost drivers to D2W), and perform a compari... »

How Will Future Capex Spending Affect Semiconductor Suppliers?

How Will Future Capex Spending Affect Semiconductor Suppliers?

At the recent Arizona SEMI Breakfast Forum, held April 17, 2015, semiconductor suppliers gathered at the Mother Ship (aka Intel) in Ocotillo, AZ, to hear information that could affect their sales of tools and materials, based on the expectations of industry capacity expansion over the coming years. As the theme for the day was “Wafers to Wall Street: Emerging Markets”, SEMI organizers tapped... »

A Trip Down Silicon Valley’s Memory Lane with Bill Hugle

A Trip Down Silicon Valley’s Memory Lane with Bill Hugle

Inspired by all the recent attention for the 50th anniversary of Moore’s Law and SEMI’s cool new Infographic series, which reflects the industry’s role in “Making Small Things Makes Big Things Possible,” my colleague and Impress Labs managing partner, Martijn Pierik, took me on a trip down Silicon Valley Memory Lane, sharing his personal treasure trove of memorabilia from the archives of... »

KLA-Tencor Introduces New Portfolio for Advanced Semiconductor Packaging

KLA-Tencor Introduces New Portfolio for Advanced Semiconductor Packaging

KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP™ and ICOS® T830. Designed for characterization and monitoring of the diverse processes used in wafer-level packaging, CIRCL-AP enables all-surface wafer defect inspection, review and metrology at high throughput. The ICOS T830 provides fully automated optical insp... »

Page 1 of 212