Archives March 2015 - 3D InCites

SEMI-THERM 2015: Thermal Innovations that Make the World’s Technology Cool

SEMI-THERM 2015: Thermal Innovations that Make the World’s Technology Cool

From March 16-20 the annual SEMI-THERM Conference (SEMI-THERM 2015) in San Jose gave me the opportunity to meet many assembly, materials, and thermal management experts. I also learned a lot about how IC packages and PCBs protect and cool single- and multi-die ICs. Both contribute significantly to cost, performance, and reliability of these designs. Let me share with you my general impressions f... »

Flying Many Flags: Heterogeneous Integration at CS International 2015

Flying Many Flags: Heterogeneous Integration at CS International 2015

The fifth annual CS International Conference, 2015 edition, was held in Frankfurt, Germany, March 11-12, 2015. Very conveniently located in the Sheraton Frankfurt Airport Hotel & Conference Center, just steps away from where I deplaned in Frankfurt after my flight from Dulles.  Over the course of its 2 days, CS International 2015, offered 6 major themes, spread over 37 individual presentati... »

3D InCites Opens Nominations for the 2015 3D InCites Awards

3D InCites Opens Nominations for the 2015 3D InCites Awards

Phoenix AZ – March 26, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced it has partnered with Impress foundation to co-host the third annual 3D InCites Awards during SEMICON West 2015. 3D InCites also announced this year’s proceeds will fund two STEM-based academic scholarships: SEMI Foundation’s SEMI High Tech U Program, which p... »

DATE 2015 demonstrates Europe’s commitment to Semiconductors, Part 2

DATE 2015 demonstrates Europe’s commitment to Semiconductors, Part 2

Continuing from Part 1: On Thursday morning I really enjoyed the Monolithic 3D session. Francoise already reported about it, so I can be brief and focus on the most advanced program presented, the CEA Leti CoolCube™ . Olivier Billoint showed and explained how Leti, in cooperation with an EDA partner, is developing the integration of two layers of functions on a wafer. The first layer uses a reg... »

IMAPS DPC 2015: Has 3D IC Hit a Holding Pattern?

IMAPS DPC 2015: Has 3D IC Hit a Holding Pattern?

From the perspective of 3D integration and its march towards commercialization, there was not much new being presented at the 2015 IMAPS Device Packaging Conference and the Global Business Council (IMAPS DPC 2015) held concurrently in Fountain Hills, AZ, (March 16-19); at least not since the European 3D TSV Summit 2015, or 3D ASIP 2014 before that, or even GIT 2014, IWLPC 2014, and IMAPS Intern... »

CoolCube™: A True 3DVLSI Alternative to Scaling

CoolCube™: A True 3DVLSI Alternative to Scaling

Stacking transistors on top of each other sequentially in the same front-end process flow is a concept that has been imagined to provide the semiconductor community with an alternative to the traditional scaling paradigm challenged by technical and cost roadblocks. LETI Advanced CMOS Laboratory introduced CoolCube™, a low-temperature process flow that provides a true path to 3DVLSI. »

DATE 2015 demonstrates Europe’s commitment to Semiconductors

DATE 2015 demonstrates Europe’s commitment to Semiconductors

Full disclosure: I spent the first half of my life in Europe. I was born and raised in Austria, and earned my engineering and business degrees at government funded schools there. I worked more than 12 years in technical and business roles in Munich, covering all of Western Europe. If you can read some bias for Europe between the lines below, you are not mistaken. Spending the first half of March i... »

Heterointegration Spoor in the 2015 Analog, MEMS and Sensor Startups to Watch, Part 3

Heterointegration Spoor in the 2015 Analog, MEMS and Sensor Startups to Watch, Part 3

In Parts 1 and 2 of this series, I drew your attention to what Peter Clarke, writing in EETimes on 02 January 2015, called the “15-in-15: Analog, MEMS and sensor startups to watch in 2015.” If we were to look for heterointegration spoor amongst Peter’s 15 notable startups what would we find? The first “10-in-15” companies profiled in Parts 1 and 2, namely Cambridge CMOS Sensors; Chirp Mi... »

Is Complex Packaging in High Volume Manufacturing (HVM)?

Is Complex Packaging in High Volume Manufacturing (HVM)?

Over the past year… The amount of 2.5/3D articles published has gained momentum. Some articles discuss when HVM will be achieved for this complex packaging, others discuss costs from chip to system levels, how to evaluate options, design and verify, etc. All articles are based on facts gleaned from various articles, presentations and conferences that authors have viewed or participated in. The... »

Advancing Sensing Solutions to 3D and Beyond

Advancing Sensing Solutions to 3D and Beyond

A second side trip on the way to DATE 2015 brought me back to Nimes, France to check up on activities at Fogale Nanotech since last year. I was reminded once again, that Fogale isn’t just a semiconductor equipment supplier. Its core competencies are optical and capacitive sensing technologies, and thanks to the entrepreneurial spirit of the company’s CEO, Patrick Leteurtre, the compa... »

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