Archives November 2014 - Page 2 of 2 - 3D InCites

Kahoots from the IWLPC 3D InCites Panel

Kahoots from the IWLPC 3D InCites Panel

Interposer designs and 3D ICs shift a significant part of the value creation to material vendors and assembly/test houses. It’s only logical that Françoise von Trapp, in her role as Queen of 3D, moderated a high-profile 3D panel this week at the International Wafer Level Packaging Conference (IWLPC), at the DoubleTree Hotel in San Jose, CA. The panelists represented a cross section of our indus... »

OmniVision Launches Family of High Performance 20+ Megapixel Image Sensors for Flagship Smartphones

OmniVision Launches Family of High Performance 20+ Megapixel Image Sensors for Flagship Smartphones

OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, today announced the OV23850 and OV21840, a family of PureCel-S™ 20+ megapixel image sensors with image quality and performance comparable to DSCs and DVCs. Using OmniVision’s advanced stacked die process, the OV23850 and OV21840 capture stunning images and video in 23.8-megapixel and 21... »

Topics of Discussion at GIT 2014

Topics of Discussion at GIT 2014

In my previous post I talked a bit about the ongoing debate that went on during last week’s Global Interposer Technology Workshop (GIT 2014) which took place at Georgia Tech’s Global Learning Center. Do we wait for the “trickle down” effect to take place and bring the cost of interposer and 3D ICs down, or do we create a consortium to focus on developing low-cost interposer solutions?... »

GIT 2014: “Call them Interposers, as God Intended”

GIT 2014: “Call them Interposers, as God Intended”

Subu: “I find the whole concept of 2.5D fairly atrocious. I have banned its use.” Rao: “what are you going to call it?” Subu: “Interposers, like God intended it to be.” The exchange quoted above took place between Subramanian Iyer, PhD, Director, Systems Scaling Technology IBM, and co-chair of this year’s Global Interposer Technology Workshop (GIT2014), and ... »

Tango Systems Inc. Achieves Conformal Deposition for 15:1 Aspect Ratio TSVs

Tango Systems Inc. Achieves Conformal Deposition for 15:1 Aspect Ratio TSVs

Tango Systems Inc., a leading innovator in high-performance, cost-effective physical vapor deposition (PVD) systems, today announced it has published results for conformal step seed layer coverage for through silicon vias (TSVs) with a 15:1 aspect ratio. This significant achievement represents the industry’s highest TSV step coverage for interposers and 3D ICs. The results were achieved using T... »

GLOBALFOUNDRIES has its 3D Ducks in a Row

GLOBALFOUNDRIES has its 3D Ducks in a Row

The news about 3D readiness just keeps getting better. Last week I tuned into a GLOBALFOUNDRIES webcast, featuring speaker Rama Alapati, Director Packaging Engineering, GLOBALFOUNDRIES. Alapati spoke for an hour about the companies’ approach to interposer and 3D integration technologies, and how the open innovation approach has allowed them to develop the critical partnerships with EDA vendors, ... »

3D-TEST Workshop Does What Its Name Says: Concentrates On 3D-Test

3D-TEST Workshop Does What Its Name Says: Concentrates On 3D-Test

Virtually all scientific and industry forums on 3D have “3D design-for-test” and/or “3D test” on the topic list of their Call for Papers, but typically at the very bottom of that list, and in practice they focus on 3D technology and/or 3D design and do not offer much 3D-test content. If you don’t believe me, check for yourself how often the word “test” appears in the programs of ... »

3D+: Inspired by Heterogeneous Integration

3D+: Inspired by Heterogeneous Integration

Some technologies take forever to cross the chasm into successful commercialization. Or they never do, and end up together with Wile E. Coyote at the bottom of the canyon. My take today is that heterogeneous integration is showing signs of a successful chasm leap. Heterogeneous integration is going to be the Roadrunner. Therefore, we intend, at 3D InCites, to cover the topic of heterogeneous int... »

Page 2 of 212