Archives September 2014 - Page 2 of 2 - 3D InCites

Next-Gen MEMS Simulation Tool Makes Life Easier for ASIC Designers

Next-Gen MEMS Simulation Tool Makes Life Easier for ASIC Designers

I don’t usually write about MEMS. But every once in a while, when MEMS (stands for micro-electromechanical systems) touches anything to do with 3D integration, usually at the system-level, I might veer slightly out of my comfort zone to interview a MEMS supplier about their latest developments. I find it’s a good way to learn about the synergies and to cross-pollinate information. Today wa... »

Semicon EUROPA

Where to find 3D Integration at SEMICON Europa

While at first glance, 3D integration technologies seem to be relegated to one two-hour session at this year’s SEMICON Europa, which takes place October 7-9, 2014 in Grenoble, France; in reality 3D integration is a pervasive technology that will be discussed in many different programs and sessions. To make it easier for anyone who wishes to focus their time learning how 3D integration applies in... »

Kulicke & Soffa Introduces APAMA – New Thermo-Compression Bonder

Kulicke & Soffa Introduces APAMA – New Thermo-Compression Bonder

Kulicke and Soffa Industries, Inc. announced the introduction of APAMA (Advanced Packaging with Adaptive Machine Analytics), the Company’s new Chip-to-Substrate (C2S) bonder that answers today’s thermo-compression bonding challenges. The APAMA was designed with performance and accuracy in mind, delivering the best-in-class die-stacking solution for 2.5D / 3D or TSV integrated chips. The key hi... »

Lithography Challenges for 2.5D Interposer Manufacturing

Lithography Challenges for 2.5D Interposer Manufacturing

In recent years, 2.5D packaging has quickly gained acceptance as an advanced packaging process, and the first products using this technology are now coming to market.¹ Most estimates project growth for 2.5D interposer packaging faster than the industry as a whole. Similar to the multi-chip modules (MCMs) of the past, 2.5D packaging processes use an interposer with vias connecting the metallizatio... »

Are we Getting Mixed Messages on 3D IC Production?

Are we Getting Mixed Messages on 3D IC Production?

While 3D IC production is underway for memory devices, some say demand for 3D ICs is still years away. Could both be right, or are we getting mixed messages? Today’s news from  SEMICON Taiwan, in which a DigiTimes reporter quoted Mike Liang, president of Amkor Technology Taiwan as saying that 3D IC parts won’t be in demand for another three years, threw a bit of cold water on excitement gener... »

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