Archives July 2014 - 3D InCites

GlobalFoundries and IBM: Stuck on the Rumor Mill?

GlobalFoundries and IBM: Stuck on the Rumor Mill?

There’s nothing like a little industry gossip to get the juices flowing. I love it when the media churns out news articles based purely on speculation, quoting individuals who request anonymity, and publishing the names and titles of those who refuse to comment on speculation. No doubt you’ve all seen the reports being published about the lack of agreement reached between IBM and GlobalFoundri... »

Semiconductor Equipment Manufacturer Consolidation Update

Semiconductor Equipment Manufacturer Consolidation Update

It was a much-talked-about topic this year at SEMICON West 2014 (SW2014) – this trend of semiconductor equipment manufacturer consolidation. Just in the past year, we’ve read the headlines about Applied Materials (AMAT) and Tokyo Electron ‘s (TEL) impending merger; LTX Credence’s acquisition of Multitest, Everett Charles, Technologies and atg Luther & Maelzer businesses from Do... »

The Internet of Things and Semiconductor Test

The Internet of Things and Semiconductor Test

Herb Reiter, eda2asic, presented this poster presentation titled “The Internet of Things and Semiconductor Test” at the Test Vision 2020 Workshop during Semicon West 2014. Here is the printed transcript of the talk. The accompanying slides referenced in the text can be downloaded as well. In the 1990s cell phones started to connect people wirelessly and changed the way of verbal commun... »

SEMICON West 2014: Supplier Updates for 2.5D and 3D Processes

SEMICON West 2014: Supplier Updates for 2.5D and 3D Processes

SEMICON West 2014 brought its usual flurry of supplier announcements on new equipment and process improvements; but there weren’t as many focused on 3D technologies as there have been in past years. This is likely due to the fact that some players are holding off until 3D hits it big and they get some return on their investment. But for the true die-hards, they’re not letting a little thing li... »

Rudolph Announces New SONUS Technology and Collaboration with TEL NEXX for Advanced Packaging Process Control

Rudolph Announces New SONUS Technology and Collaboration with TEL NEXX for Advanced Packaging Process Control

Non-contact, non-destructive acoustic technology fulfills growing need in advanced packaging for thick film metrology up to 100μm and void detection down to 0.5μm Flanders, New Jersey (July 21, 2014)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today the availability of its new SONUS™ Technology, designed for measuring thick films and film stacks used in copper pillar bumps and for dete... »

Courtesy of Apple and IBM

Apple and IBM on the Way to Demonstrate That ONE plus ONE is More Than TWO

Tuesday’s (July 15) Nightly Business Report surprised me with an – in my view – very important announcement: Apple and IBM are going to cooperate to offer enterprise solutions. See more about this significant step here and in many other headline news coming out this week. The former rivals are joining forces to combine Apple’s user-friendly hardware with IBM’s enterprise experience and s... »

Does 3D Integration Need to Go to HVM To be Real?

Does 3D Integration Need to Go to HVM To be Real?

Consider for a moment that the ultimate goal of 3D integration is not to achieve high volume manufacturing (HVM) in high bandwidth memory and logic applications for mobile devices, but rather to be an enabler for heterogeneous integration of disparate technologies for everything from medical and automotive applications to industrial sensing, military and the Internet of Things (IoT)? Would that cr... »

Market Outlook for Permanent Wafer Bonding

Market Outlook for Permanent Wafer Bonding

Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized into insulating layers including glass frit bonding, adhesive bonding, or metallic bonding including Cu-Cu/oxide “hybrid” bonding, solder bonding, and thermo-compression copper-copper bonding as shown in Figure 1. MEMS devices are the main applications us... »

Mark Adams Keynote Calls for Partnership in a Changing Semiconductor Landscape

Mark Adams Keynote Calls for Partnership in a Changing Semiconductor Landscape

The winds of change are blowing in the semiconductor industry. And while some cling tightly to the way things have always been, it’s becoming more apparent that for those who can adapt, there are a multitude of opportunities, and for those who think it can stay the same, it will be more challenging going forward. This was the key message of the SEMICON West 2014 keynote address by Mark Adams, Pr... »

Highlights of the 2014 3D InCites Awards Breakfast

Highlights of the 2014 3D InCites Awards Breakfast

For the second consecutive year, a sizable group of 3D integration enthusiasts gathered at the Impress Lounge to honor the innovators in 2.5D and 3D technologies at the 2014 3D InCites Awards Breakfast. The program included a thought-provoking keynote by Bryan Black, Senior Fellow at AMD, as well as brief presentations by Jan Vardaman, TechSearch International; and Karen Savala, President of SEMI ... »

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