Archives May 2014 - 3D InCites

3D NAND Flash – Schiltron’s Answer

3D NAND Flash – Schiltron’s Answer

It probably appears that the only 3D technologies vying for 2D NAND’s crown are V-NAND from Samsung and p-BiCS from Toshiba/SanDisk, with their key selling point being their ability to use few lithography steps to build 3D stacked memory. For background, see Jim Handy’s series and mine. Here I will discuss the 3D NAND Flash alternative from my company, Schiltron Corporation, that provides a so... »

Ziptronix and EV Group Demonstrate Submicron Accuracies  for Wafer-to-Wafer Hybrid Bonding

Ziptronix and EV Group Demonstrate Submicron Accuracies for Wafer-to-Wafer Hybrid Bonding

Enables fine-pitch connections for 3D applications, including image sensors, memory and 3D SoCs RESEARCH TRIANGLE PARK, N.C., May 27, 2014 – Ziptronix Inc. and EV Group (“EVG”) today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix’s DBI® Hybrid Bonding techn... »

Lasertec: BGM300

Lasertec: BGM300

The BGM300 was designed to enable quick and accurate measurement of Through Si Via (TSV) depths, Si wafer thickness, and Remaining Si Thickness (RST) above TSVs – all essential in a managed backside via reveal process flow. Back grinding errors due to “blind” grinding can lead to significant yield loss. Testimonial: During the back grinding process to reveal the TSV, it is extremely importan... »

SSEC: Innovators in Single Wafer Wet Processing Tools

SSEC: Innovators in Single Wafer Wet Processing Tools

49 years ago, Solid State Equipment, LLC (SSEC) opened its doors with its first piece of semiconductor equipment; a seam sealer for welding the lid on hermetic packages. Today, that tool still exists, and although it now accounts for 1% of SSEC’s revenue instead of 50%, sales have remained constant throughout the years. Since then, the company has gone on to be a leader in single wafer wet proce... »

Fogale: TMAP DUAL 3D 300 A

Fogale: TMAP DUAL 3D 300 A

The TMAP DUAL 3D 300 A is a unique metrology and inspection tool available to the semiconductor industry capable of addressing all customer measurement requirements for MEMS and 3D packaging. The TMAP is highly flexible, accurate, and repeatable. The heart of this tool is based on multi-sensor heads which include different technologies in the same integrated tool. As an example, double IR microsco... »

3d NAND

News of 3D NAND Fab Construction: A sign of Progress or a PR Ruse?

While I don’t claim to be an expert in 3D NAND technologies, I do keep my eye on what’s happening in the 3D NAND market. So when two 3D NAND-related EE Times articles crossed my 3D radar in two days, I naturally checked it out. After reading both articles, I have questions. First of all, Gary Hilson, EE Times, posted a news analysis piece provocatively titled, Samsung Ramps Up 3D NAND Fab ... »

SPTS Technologies Announces the Omega® Rapier XE System for 300mm Wafer Silicon Etch Processing

SPTS Technologies Announces the Omega® Rapier XE System for 300mm Wafer Silicon Etch Processing

Newport, United Kingdom, 22 May, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the launch of its Rapier XE system for 300mm wafer silicon etch processing. The new module offers significant advantages over competing systems as well as improved etch rate over the 1st generation Rapier in applic... »

Survey and Review of  2.5D and 3D IC Packaging Technologies

Survey and Review of 2.5D and 3D IC Packaging Technologies

On April 9, 2014 Herb Reiter presented a 2.5D and 3D IC packaging-centric update in context with an IEEE/CPMT dinner meeting at the Biltmore Hotel in Santa Clara. About 50 silicon-, packaging-, assembly and test experts attended this 1-hour presentation. Most of them stayed for the very interactive Q & A session, that turned out be last another hour. In his presentation, Reiter discussed ̶... »

Will the Internet of Things Change the Way We Look at 2.5D and 3D ICs?

Will the Internet of Things Change the Way We Look at 2.5D and 3D ICs?

Years ago I saw Dr. Wayne Dyer on Public Television. He talked about “The Power of Intention”. The engineering-driven half of my mind didn’t pay much attention to such a mushy topic…. until Dr. Dyer confused me with what sounded like a play on words. He said “When you change the way you look at things, the things you look at change!” Thanks to my digital video recorder, I was able to g... »

NORDSON Dage: XM8000 Wafer X-ray Metrology Platform

NORDSON Dage: XM8000 Wafer X-ray Metrology Platform

Fully automatic, in-line X-ray metrology platform for the measurement and defect capture of both optically hidden and visible features in wafers and 2.5D/3D IC packages. Available measurements include voiding, via fill, overlay and critical dimensions in TSVs, wafer bumps and MEMS. Testimonial: The XM8000 Wafer Metrology Platform provides a new and unique X-ray metrology platform for fast, automat... »

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