Archives April 2014 - Page 2 of 2 - 3D InCites

GSA Silicon Summit: What’s next for the 2.5D/3D Ecosystem?

GSA Silicon Summit: What’s next for the 2.5D/3D Ecosystem?

Due to schedule conflicts, I was unable to attend this year’s Silicon Summit, which took place April 10, 2014 at the Computer History Museum, and featured a segment titled GSA Silicon Summit 2014: 2.5D/3D Ecosystem – What’s Next? Luckily, Rick McClellen, director of business development at Ziptronix briefed me on the event key takaways, which I’ve noted here and offered some of my own obse... »

Deca Technologies Ships 100-Millionth WLP Component

Deca Technologies Ships 100-Millionth WLP Component

Fully Automated Manufacturing Technology Drives Growth for WLP Startup Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth wafer-level packaged (WLP) component. The company attributes this milestone to strong demand from portable electronics manufacturers for wafer-level chip scale packages (WLCSP) ma... »

ASE and Inotera Memories to Offer Novel 2.5D Manufacturing Solutions

ASE and Inotera Memories to Offer Novel 2.5D Manufacturing Solutions

Last week, ASE and Inotera Memories announced they had entered into a joint development project (JDP) intended to both strengthen ASE’s system-in-package (SiP) capabilities and expand Inotera’s foundry services beyond its core competency of memory manufacturing to silicon interposers. The goal is to provide novel 2.5D manufacturing solutions. Prior to the companies’ official announcement, ru... »

Oerlikon Systems: Pragmatic and Poised for  3D IC High Volume Manufacturing

Oerlikon Systems: Pragmatic and Poised for 3D IC High Volume Manufacturing

In the last 40 years, the Principality of Liechtenstein has evolved from a purely agricultural state into one of the most highly industrialized countries in the world. But some how it has managed to keep its Alpine charm. That’s why at first glance, the city of Balzers, complete with its hilltop castle, did not strike me as a place to find a major manufacturer of high tech semiconductor equipmen... »

Fans of the Fork

When You Come to a Fork In the Road, Take It

When Yogi Berra made this very wise statement, he certainly didn’t mean to give specific advice what to choose. I interpret his statement as an encouragement to make an educated decision and pick the best alternative, whenever you come to a fork in the road. The semiconductor industry is facing such a fork in the road to continued success. As the attached slide from last year’s CDN Live confer... »

3D Test

Cascade Microtech: In the imec 3D Test Lab

My visit to imec to meet with the Cascade Micorotech and imec 3D Test collaboration team included a tour of the 3D test lab to see the CM300 in action, so we suited up for Class 1000 cleanroom and stepped inside. Generally we would have had to prep for class 100 or higher for the test environment, but thanks to nifty new FOUPs that have a class 1 microenvironment to protect the wafers, we at least... »

Cascade Microtech Breaks Through the Barriers of 3D Test

Cascade Microtech Breaks Through the Barriers of 3D Test

For quite some time, the lack of cost-effective test solutions for 2.5D interposers and 3D stacked ICs (3D SICs) has been at the top of many industry experts’ laundry list of ‘what’s-holding-up-commercialization for 3D’. First, there are technology issues: fine-pitch probing, pin count, contact force and the phenomenon of weak I/O drivers. But bigger than that, the cost of 3D test is a maj... »

3D Workshop Panel Discussion Focuses on 3D Standards and EDA Tool Readiness

3D Workshop Panel Discussion Focuses on 3D Standards and EDA Tool Readiness

 Are slow standardization and CAD-tool development hindering the progress of 3D IC design and integration? This was the topic of discussion during the Friday 3D Workshop at DATE 2014, which took place this year in Dresden, March 28, 2014. I was invited to moderate this panel discussion, which featured panelists from EDA suppliers, industry, and academia. We wanted to mix it up a bit and involve ... »

SUSS MicroTec Launches Mask Aligner MA200 Gen3

SUSS MicroTec Launches Mask Aligner MA200 Gen3

Garching, April 2, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the new Mask Aligner MA200 Gen3 today. The tool is designed for high-volume manufacturing and can be used for exposing wafers with a diameter of up to 200mm. This latest generation tool is a further development of the very successful MA200... »

3D Integration Workshop Faces Reliability Challenges Head On

3D Integration Workshop Faces Reliability Challenges Head On

The Friday 3D Integration Workshop at DATE 2014 once again found me among friends, as an intimate group of about 30 gathered to spend a day sharing knowledge gained since last year’s workshop. My key take-away for the day was how to achieve reliability and robustness. Jürgen Wolf, director of the Fraunhofer IZM-ASSID 3D integration program stepped in as keynote speaker to replace Yole Développ... »

Page 2 of 212