Archives April 2014 - 3D InCites

Process Improvements Target 3D IC Cost of Ownership

Process Improvements Target 3D IC Cost of Ownership

Customers have asked and suppliers are listening. One sign of progress from last year to this year at SEMICON Singapore’s 3D IC Forum was the number of supplier presentations focused on process improvements that have been developed to lower the 3D IC cost of ownership (CoO). In addition to the cost-effective implementation of interposer technologies being worked on at Singapore’s A*STAR Instit... »

IME's Through Silicon Interposer

Circumventing Temporary Bond/Debond, and other Cost-Saving Approaches to 2.5D Interposers

While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB) to be an unsolvable challenge that adds unnecessary cost. The solution? Find a way to do away with it altogether. During the 3D IC Forum at SEMICON Singapore, both A*STAR Institute for Microelectronics (IME) and Invensas Technologies demonstrated that the best way ov... »

SUSS MicroTec launches the new Mask Aligner MA12

SUSS MicroTec launches the new Mask Aligner MA12

Garching, April 29, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the Mask Aligner MA12 today. This semi-automated tool is designed for industrial research and production of wafers up to 300mm and 300x300mm square substrates. It represents the latest mask aligner technology in terms of accuracy, optical... »

SEMICON Southeast Asia to be Launched in 2015

SEMICON Southeast Asia to be Launched in 2015

Regional Exposition to Rotate between Singapore and other areas in the region Recognizing the changing dynamics of the microelectronics industry in Southeast Asia, SEMI announced the expanded scope of its industry-leading SEMICON regional exposition, which will now rotate between Singapore and other locations within Southeast Asia. Building on the twenty-year history of SEMICON Singapore, the expa... »

3D IC Adoption: What’s it going to Take?

3D IC Adoption: What’s it going to Take?

If, as we heard at last week’s 3D IC Forum at SEMICON Singapore, that technology challenges and cost are no longer keeping 3D ICs from volume manufacturing, and indeed the key players are ready to go, then what’s it going to take to get this 3D IC adoption party started? It’s clearly becoming a matter of convincing SoC designers and system-level designers that 3D ICs offer cost benef... »

SEMICON Singapore 2014: A Rosy Outlook for 2.5D and 3D ICs

SEMICON Singapore 2014: A Rosy Outlook for 2.5D and 3D ICs

This week, at the invitation of SEMI Southeast Asia, I made the monumental trek from Phoenix, AZ to Singapore to attend SEMICON Singapore. While I know many of my industry colleagues make these journeys in the regular course of business, this was a new experience for me and my first visit to both Singapore and SEMICON Singapore, which has historically been focused on the packaging, test and assemb... »

STS Semiconductor and Invensas to Partner on High Volume Bond Via Array (BVA) Mobile Solutions

STS Semiconductor and Invensas to Partner on High Volume Bond Via Array (BVA) Mobile Solutions

Tessera Technologies, Inc., announced today that Invensas Corporation, its wholly owned subsidiary, and Seoul, South Korea-based STS Semiconductor & Telecommunications Co. Ltd., a leading semiconductor assembly and test solution provider specializing in mobile and communication devices, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via... »

2013 ITRS Roadmap Calls for 3D Power Scaling; Monolithic 3D Gains Traction

2013 ITRS Roadmap Calls for 3D Power Scaling; Monolithic 3D Gains Traction

At the beginning of April, the Semiconductor Industry Association released the 2013 International Roadmap for Semiconductors (ITRS), which has traditionally served as a guide for “assessing and improving the future of semiconductor technology,” according to Brian Toohey, president and CEO, Semiconductor Industry Association. Sponsored by five regions of the world including Europe, Japan, Korea... »

A Sneak Peek at IITC and AMC 2014

A Sneak Peek at IITC and AMC 2014

The recent announcement of the International Interconnect Technology Conference (IITC), combined with the Advanced Metallization Conference (AMC) in the Double Tree Hotel in San Jose, from May 20-23, caught my eye, because it also offers several sessions relevant for 3D-IC materials and manufacturing. On Tuesday, May 20, will be a day-long Workshop on “Manufacturing of Interconnect Technologies:... »

Rudolph Technologies: JetStep S Series Lithography System

Rudolph Technologies: JetStep S Series Lithography System

As advanced packaging facilities transition their manufacturing from round wafers to square panels, the JetStep S Series Lithography System is fully capable of handling panels up to Gen 3.5 (720x650mm). The system offers high throughput through a large printable exposure and increased productivity through on-the-fly autofocus for thick photoresists. Testimonial Moving from round wafers to rectangu... »

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