Archives February 2014 - 3D InCites

SUSS MicroTec launches ELP300 Gen2: The Latest Generation of Excimer Laser Steppers

SUSS MicroTec launches ELP300 Gen2: The Latest Generation of Excimer Laser Steppers

Garching, February 19, 2014 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announced the launch of its ELP300 Gen2. This latest generation of excimer laser steppers provides a means to directly create vias (< 5µm) and microstructures, addressing the limitations of traditional photo-dielectrics and photolithography st... »

TCI for Wireless Chip Stacking; Progress for Monolithic 3D

TCI for Wireless Chip Stacking; Progress for Monolithic 3D

Every once in a while, it’s important to remember that through silicon vias (TSVs) might not be the only game in town. While many continue to forge ahead, with commercialization so close we can taste it, others are already moving on to the next thing or looking for alternatives. Will these beat TSVs to the finish line? Not likely, considering this industry’s slow-to-adopt culture. But it’s s... »

Progress Reports for 3D IC Thermal Management and Test

Progress Reports for 3D IC Thermal Management and Test

In Jan Vardaman’s recent readiness report card issued at 3D ASIP in December, 3D IC thermal management issues scored and “F” for lack of a solution o the hot-spot problem when stacking memory on logic. And while she gave 3D IC test a “B” for probe card development, it got an incomplete for reliability data. At the end of her presentation, she invited anyone with new solutions to “see ... »

Samsung’s V-NAND Flash at the 2014 ISSCC: Ye Distant Spires…

Samsung’s V-NAND Flash at the 2014 ISSCC: Ye Distant Spires…

True to form, Samsung followed up it’s V-NAND Flash announcement of 2013 with a product chip-level presentation at the 2014 IEEE International Solid-State Circuits Conference (ISSCC) in San Francisco on February 12th. This provides the ideal opportunity to study the result of their work at the product level and compare with the predictions that I made in the Towering Spires or Costly Cany... »

Fraunhofer EMFT: 25 years of 3D Integration in Munich

Fraunhofer EMFT: 25 years of 3D Integration in Munich

Wouldn’t it be great to get a text notification that you are almost out of toilet paper at home rather than when it’s well… almost too late? Or how about an intra-nasal sensor that detects the level of acetone in your breath to tell you if you’re accumulating or burning fat? (It kind of makes my new FitBit wearable activity monitor seem archaic already.) But this is the beginning of the I... »

Rudolph Ships NSX 320 TSV Metrology System to CEA-Leti  for TSV Process Development

Rudolph Ships NSX 320 TSV Metrology System to CEA-Leti for TSV Process Development

Flanders, New Jersey (February 11, 2014)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today the sale of its first NSX® 320 TSV Metrology System to CEA-Leti, a leading research organization based in Grenoble, France, which, in the frame of the Nanoelec Research Technology Institute (Nanoelec RTI) program, is developing three-dimensional integrated circuit (3DIC) technologies that use throug... »

EV Group Unveils HVM Photoresist Processing System for Logic and Memory Advanced Packaging Applications

EV Group Unveils HVM Photoresist Processing System for Logic and Memory Advanced Packaging Applications

ST. FLORIAN, Austria, February 11, 2014 — EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing (HVM)—the EVG150XT resist coating and developing system.  Leveraging EVG’s XT Frame platform utilized across t... »

Triple I Prevails at EV Group

Triple I Prevails at EV Group

Invent, Innovate, Implement continues to be the mantra at EV Group, supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets. In visits I’ve made to EVG’s Schaerding, Austria world headquarters over the years, it’s clear that this Triple I approach is working for the company, which has experienced consistent growth. While I was sufficiently ... »

Spirox to Represent Multitest Business for Taiwan and China

Spirox to Represent Multitest Business for Taiwan and China

In a move to create a strong local presence to enhance sales and support services for its test handler and interface product business, Multitest, a division of LTX-Credence Corporation and a designer and manufacturer of test handlers, contactors and load boards announces that Spirox Corporation will be their official representative for all its product groups in China (PRC) and Taiwan (ROC). Spiro... »

The 411 on CEA Leti’s Interposer Roadmap

The 411 on CEA Leti’s Interposer Roadmap

When is an active die not an active die? When it’s an active interposer, of course! Ever since Nicolas Sillon, former head of CEA Leti’s 3D Integration program, first talked about the research institutes’ work with interposer technology for 3D integration, the term “active interposer” has sparked controversy and begged for definition. Sillon differentiated active interposers from 3D IC... »

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