Archives December 2013 - Page 2 of 2 - 3D InCites

Invensas and Tezzaron Partner to Deliver Commercial 3D IC Products

Invensas and Tezzaron Partner to Deliver Commercial 3D IC Products

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that it is partnering with Tezzaron Semiconductor Corporation, a pioneer and producer of 3D Integrated Circuit (3D-IC) semiconductor devices, in order to build a wide range of commercial 3D-IC products. “Today we can produce complete high-quality 2.5D (Silicon Interposer) and 3D sili... »

Ziptronix Teams with Tezzaron and Novati Technologies to Accelerate 3D IC Development

Ziptronix Teams with Tezzaron and Novati Technologies to Accelerate 3D IC Development

Ziptronix Inc., provider of patented, low-temperature direct bonding technology for 3D integration, announced an agreement with Tezzaron Semiconductor Corporation and Novati Technologies, a wholly owned subsidiary of Tezzaron, as a next step toward the acceleration of 3D integration. As a key part of the agreement, Ziptronix sold its 3D IC development lab to Tezzaron, to be operated by Novati. Due... »

CEA-Leti Signs Agreement with Qualcomm To Assess Sequential 3D Technology

CEA-Leti Signs Agreement with Qualcomm To Assess Sequential 3D Technology

CEA-Leti announced an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti’s sequential 3D technology. In recent years, Leti has been actively working on a new 3D integration technology process called sequential 3D integration that enables the stacking of active layers of transistors in the third dimension. In comparis... »

EV Group Completes Next Expansion Phase of Corporate Headquarters

EV Group Completes Next Expansion Phase of Corporate Headquarters

ST. FLORIAN, Austria, December 05, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has completed the next expansion phase of its corporate headquarters in St. Florian, Austria.  In record construction time, EVG built an ultra-modern office building with a representative entrance and reception area. The ... »

3D ASIP 2013: A 10th Anniversary Retrospective

3D ASIP 2013: A 10th Anniversary Retrospective

Nothing says “Christmas is coming” to me like the annual 3D ASIP Conference that has taken place each December for the past 10 years. I actually got a late start, attending my first 3D ASIP in 2009 after I launched 3D InCites, but since then I have attended every one. I’m pretty sure I missed at least one Christmas school performance because of it. That’s how dedicated I am to it; it’s t... »

TSV Inspection using Virtual Interface Technology

TSV Inspection using Virtual Interface Technology

Frontier Semiconductor has recently introduced Virtual Interface Technology (VITTM) for TSV Inspection. In the realm of 2.5D/3D packaging, a high throughput/production ready metrology tool with a single high-performance sensor that addresses multiple measurement needs throughout the process flow, from FEOL to BEOL, can be very valuable in terms of yield improvement, cost of ownership reduction and... »

3D IC Test

3D TSV without Limits

What can we expect out of 2.5 and 3D TSV Integration? What are the three leading-edge R&D institutes in 2.5 and 3D TSV investigating? On November 18, SEMI offered a webinar entitled “3D TSV without Limits.” Francoise von Trapp of 3D InCites moderated the webinar which featured Eric Beyne, director of 3D System Integration program at imec, Herve Ribot, head of 3D at CEA-LETI and Juergen Wol... »

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