Archives November 2013 - Page 2 of 2 - 3D InCites

TSensors Summit

Catching Up With Steve Breit, Coventor, at the TSensors Summit

A journey of a trillion sensors begins with a single step. The TSensors Summit, held at Stanford University on 23 – 25 October 2013, was a showcase for the ideas and strategies that will lead the electronics industry to produce very high volumes of Microelectromechanical Systems (MEMS)-based sensors for use in new applications likely to enter the market in the coming decade. There are currently ... »

wet etch

Process-Controlled, Contamination-Free Wet Etch from SSEC

I’ve been following the progress of wet etch processes for TSV reveal steps, with particular focus on SSEC’s efforts in this area, since I first heard SSEC CTO Laura Mauer present on the topic at the European TSV Summit. At IWLPC 2013, I caught up with SSEC’s VP of Marketing, Erwan Le Roy, to learn more about the company’s recent tool enhancement—the MultiPath Collection Drain—introduc... »

Part 2: 3D NAND Flash: Towering Spires or Costly Canyons?

Part 2: 3D NAND Flash: Towering Spires or Costly Canyons?

In my last blog posting I went over the cost aspects of the Samsung-Toshiba 3D NAND approaches. The conclusion is quite stark: if those vertical holes and trenches are more than a few tenths of a degree from the vertical, then the whole approach can be undercut in cost by more lithography-intensive layered approaches. At the risk of belaboring that point, see the IEEE paper published this month. N... »

Vacuum Dry System

Surface Preparation Advancements from Akrion Systems

Sometimes, it’s the seemingly little things that make all the difference. Like for example, who knew that thoroughly drying a wafer is critical to cleaning post TSV etch to achieve optimal surface preparation? At IWLCP 2013 last week, I spoke with Ismail Kashkoush, Ph.D., Akrion Systems’ V.P. of Products and Technology, who presented a paper, Vacuum-Assisted Wet Processing for Advanced 3D ... »

IWLPC 2013

Thoughts on 2.5D and 3D IC Progress, as Presented at IWLPC 2013

The 10th International Wafer-level Packaging Conference (IWLPC 2013) was held at the DoubleTree Hotel in San Jose this week. I had an opportunity to attend part of the technical sessions and the keynote Invensas’ president, Simon Mc Elrea, presented on Thursday morning. I also enjoyed the 3D Panel, moderated by Sitaram Arkalgud, formerly at SEMATECH, now at Invensas, on Thursday afternoon. If yo... »

IWLPC 2013: Will the Changing Mobile World Usher in 3D ICs?

IWLPC 2013: Will the Changing Mobile World Usher in 3D ICs?

…For while the tired waves, vainly breaking, Seem here no painful inch to gain, Far back, through creeks and inlets making, Comes silent, flooding in, the main…. (Excerpt from Say not the Struggle Naught Availeth, by Arthur Hugh Clough. 1819–1861) Sitaram Arkalgud, Invensas, quoted this verse to me yesterday over coffee, as we sat discussing the 3D panel he had just moderated as IWLPC 2013 w... »

The Back Story on Besang’s True 3D ICs

The Back Story on Besang’s True 3D ICs

BeSang Inc, a fabless semiconductor company in Beaverton, OR, has been on my 3D IC radar since 2008, when I first edited a 3D technology cover feature in Advanced Packaging Magazine, written by George C. Riley, that included a status report on BeSang’s TRUE 3D ICs™, which had just been demonstrated. What I didn’t understand then, that I know now, was that this was an example of what we today... »

3D Memory Using Conductive Lines for Vertical Interconnects

3D Memory Using Conductive Lines for Vertical Interconnects

The push for size reduction is reaching the segment of vertical interconnects. Current technology has a lower limit of approximately 0.150mm (0.006”) with pump and materials being the limiting factor. GPD Global through cooperation with MicroCoat Technologies have developed a process to dispense vertical interconnects at line widths from 0.075 to 0.100mm. A combination of fluid formulation and p... »

Internet of Things

Friday’s Blog is brought to you by the Internet of Things

The Internet of Things, or “IoT” certainly seems to be the social media buzz phrase of the week. It seems every link I clicked on today took me to a post discussing the IoT. You can blame the flurry of technical blog coverage on recent events like the Trillion Sensors Summit, ARM TechCon 2013, CIsco’s Internet of Things World Forum, and Intel’s IDF 2013. All at once, Cisco Systems, Fai... »

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