Archives October 2013 - Page 2 of 2 - 3D InCites

Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free Bumping

Dow Introduces SOLDERON Tin-Silver Plating Chemistry for Lead-Free Bumping

The company’s next-generation SnAg offers industry-leading plating rates and process flexibility for flip chip packages and interconnects. Dow Electronic Materials today launched its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry for use in lead-free bumping applications. This next-generation formulation features enhanced plating performance, bath stability and ease-of-use, thereby enab... »

Delft University of Technology and imec Introduce 3D-COSTAR to Optimize Test Flows of 3D Stacked Integrated Circuits

Delft University of Technology and imec Introduce 3D-COSTAR to Optimize Test Flows of 3D Stacked Integrated Circuits

Delft University of Technology (TU Delft) and nanoelectronics research center imec, introduced 3D-COSTAR, a new test flow cost modeling tool for 2.5/3D stacked integrated circuits (ICs). 3D-COSTAR aims to optimize the test flow of 3D stacked ICs (SICs), taking into account the yields and costs of design, manufacturing, packaging, test, and logistics. Due to many high-precision steps, semiconductor... »

The Many Flavors of 3D DRAM

The Many Flavors of 3D DRAM

Micron’s recent announcement that they will be shipping samples of the Hybrid Memory Cube (HMC) and ramping to production in 2014 has brought about another flurry of activity in 3D DRAM discussions. I’ve had more than one person ask me about the differences between HMC and High Bandwidth Memory (HBM). After attending last week’s IEEE 3D IC Symposium, I was curious about the differences betwe... »

2.5D Interposer wafer - TSMC

Motivation for 3D IC and other Key Take-Aways from the IEEE 3D IC Conference

The IEEE 3D Systems Integration Conference (IEEE 3D IC) is a unique event that is a truly international effort in assembling all those involved in research and commercialization of 3D IC and 3D systems from around the world. Location for the event rotates annually from Munich to Tokyo to San Francisco. This year, the event tool place in San Francisco and I was fortunate to attend. Over the cours... »

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