Archives September 2013 - 3D InCites

Invensas Wins Frost & Sullivan 2013 Mobile Computing Customer Value Enhancement Award for Bond Via Array (BVA)

Invensas Wins Frost & Sullivan 2013 Mobile Computing Customer Value Enhancement Award for Bond Via Array (BVA)

Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), today announced that it received the Frost & Sullivan 2013 North American Customer Value Enhancement Award in 3D Packaging and 3D IC Market for Mobile Computing for its Bond Via Array (BVA™) mobile technology. Complete details of the award d... »

Donning my 3D Glasses at the MEPTEC Semiconductor Roadmap Symposium

Donning my 3D Glasses at the MEPTEC Semiconductor Roadmap Symposium

I admit, I always have my 3D glasses on at conferences. But even though the title of this week’s MEPTEC event was “The Semiconductor Roadmap Symposium, A Collaborative Update From Standards Bodies, Industry Groups and the Entire Supply Chain”, it could have been “3D TSVs Roadmap Symposium…” based on the direction the panel discussions took throughout the day. Not that I’m complainin... »

MonolithIC 3D Inc. at the 2013 IEEE 3DIC Conference

MonolithIC 3D Inc. at the 2013 IEEE 3DIC Conference

Monolithic 3D is far more than just an alternative to 0.7x scaling. Zvi Or-Bach, President and CEO will present a tutorial on Monolithic 3D IC describing the multiple significant advantages of 3D IC. MonolithIC 3D Inc. the technology innovator of monolithic 3D, announced today that it was chosen to give a tutorial on monolithic 3D IC at the IEEE International Conference on 3D System Integration... »

Micron Technology Ships First HMC Samples; Plans Volume Production for 2014

Micron Technology Ships First HMC Samples; Plans Volume Production for 2014

BOISE, Idaho, Sept. 25, 2013 — Micron Technology, Inc. announced that it is shipping 2GB Hybrid Memory Cube (HMC) engineering samples. HMC represents a dramatic step forward in memory technology, and these engineering samples are the world’s first HMC devices to be shared broadly with lead customers. HMC is designed for applications requiring high-bandwidth access to memory, including ... »

ASIC Marketplace Connects Service Providers and Customers

ASIC Marketplace Connects Service Providers and Customers

Tel Aviv, Israel, 17-Sep 2013. AnySilicon, an independent semiconductor blog, launched today an online marketplace linking ASIC service providers and companies in search of IC vendors. Covering ASIC design, verification, validation, packaging, testing, and turnkey service providers, the AnySilicon site allows companies to easily find ASIC vendors anywhere in the world with specific domain expertis... »

Shaping the Future of MEMS, Sensors, and 3D IC: Fertile Grounds for Collaboration

Shaping the Future of MEMS, Sensors, and 3D IC: Fertile Grounds for Collaboration

STMicroelectronics brought a “Who’s Who” of thought leaders from across the MEMS and Sensors ecosystem to Santa Clara, CA, on September 10, 2013 to deliver practical and expert tips to the assembled attendees on using MEMS sensors to optimize performance, size, power consumption, and product cost for consumer and industrial electronic products. During this Shaping the Future of MEMS and Sens... »

Probing Questions at the IEEE 3D IC Test Workshop

Probing Questions at the IEEE 3D IC Test Workshop

As this year’s 3D IC Test Workshop unfolded (September 12 & 13, 2012), one thing became increasingly clear to me: the challenge of probing microbumps is an item of critical concern in 3D test. During the panel discussion on test requirements for 3D ICs, Saman Adham of TSMC Canada, noted that currently, microbump probing is extremely difficult and we need a better way to probe. Qualcomm’s A... »

Multitest’s Next Phase: An Interview with Reinhart Richter

Multitest’s Next Phase: An Interview with Reinhart Richter

This past July, I visited Multitest’s San Jose location to learn about the company’s activities in 3D IC test, as well as gain a better understanding of the company’s Plug & Yield™ philosophy, which spans handler, contactor and load board technologies. Earlier this month, the company announced its acquisition by LTX-Credence, along with its sister company, Everett Charles Technolog... »

TSMC 3D IC Reference Flows; A Leap Forward for the HMC

TSMC 3D IC Reference Flows; A Leap Forward for the HMC

Big news for 3D ICs this week as TSMC and its OIP Ecosystem Partners announce the release of silicon-validated reference flows for both 3D IC stacks and 16nm FinFETS (everyone else puts the 16nm FinFETS first, but I’m most excited about the 3D IC news.) According to Peter Clarke in EETimes, “silicon validation of these flows signifies the opening up of the manufacturing processes for the desig... »

3D Test Community Addresses Requirements for 3D Volume Production Testing

3D Test Community Addresses Requirements for 3D Volume Production Testing

Don’t let the skeptics fool you, contrary to popular belief, the 3D test community has been hard at work on solutions for overcoming 3D test challenges. I am attending The Fourth IEEE International Workshop on testing 3D Stacked ICs (3D Test Workshop for short) at the Disneyland Hotel in Anaheim, and its clear that at least here, solving 3D challenges is at the top of everyone’s to-do ... »

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