Archives June 2013 - 3D InCites

2.5D Interposer wafer - TSMC

3D Buzz from ConFab, 3D Integration at IITC 2013, and more

So SPIL’s offering a turnkey model for 2.5D interposers, including fine-pitch fabrication of the interposer wafers themselves? This is certainly an interesting turn of events, particularly with TSMC’s recent announcement that they’re not married to the turnkey model and are willing to collaborate with OSATS. SST’s Phil Garrou got the scoop this week from SPIL’s Mike Ma, at the Confab. Re... »

3D InCites Guide to SEMICON West 3D Events

3D InCites Guide to SEMICON West 3D Events

Each year, I publish a Guide to SEMICON West 3D Events in an attempt to integrate both SEMI-sponsored events with those of their partners, and other various happenings about town. With SEMICON West less than two weeks away – I figured it was time to get down to it. (My apologies if something gets overlooked. I generally work from my own list of go-to events.) Sum of the Minds The pre-game show s... »

New Consortium for 2.5D Through-silicon Interposer Technology to Benefit Computer and Consumer Electronics Industries

New Consortium for 2.5D Through-silicon Interposer Technology to Benefit Computer and Consumer Electronics Industries

A*STAR Institute of Microelectronics and Leading Semiconductor Partners combine research and market expertise to address industry challenges Singapore, 24 June 2013 – A*STAR Institute of Microelectronics (IME) has launched the 2.5D Through-Silicon Interposer (TSI) Consortium to accelerate market adoption of TSI technology, which is driven by strong demands in computer infrastructure and consumer... »

FormFactor: NanoPierce Contactor

FormFactor: NanoPierce Contactor

Product Description FormFactor’s NanoPierce™ contactor is a socket solution for direct testing of TSVs and micro-bump arrays for 3D IC integration. A disruptive test technology designed specifically for TSV applications, it is being used by semiconductor manufacturers in their TSV development programs. The technology was honored earlier this year at the IEEE VLSI Test Symposium in Berkeley whe... »

Cascade Microtech: CM300 Probe System

Cascade Microtech: CM300 Probe System

Product Description Cascade Microtech’s 3D probing solution, comprising the CM300 probe station and Pyramid Probe® cards with RBI technology, captures the true electrical performance of devices and helps produce high-integrity data. The CM300 achieves hands-off productivity to probe 3D stacked devices, using PTPA to successfully probe 25µm diameter micro-bumps. Testimonial Wafer probing is... »

Dynaloy, LLC: CoatsClean

Dynaloy, LLC: CoatsClean

Product Description CoatsClean ER105 is a wet resist and residue remover that has been successfully used to remove post-Bosch and post-RIE etch residue created in the formation of TSVs. It offers good process margin, allowing it to be incorporated into both spray and immersion, singe wafer and batch-type process. Testimonial Photoresist and residue removal in post TSV wet cleans in 3D packaging ap... »

SPTS: ReVia Endpoint System

SPTS: ReVia Endpoint System

Product Description ReVia is a new endpoint detection (EPD) technique that can monitor the progress of “via reveal” etch processes even at remarkably low (<0.01%) via densities. It is a unique solution that can significantly increase yields for device manufacturers involved in emerging 3D packaging applications utilizing through-silicon vias (TSVs). Testimonial Via reveal substrates typical... »

Ziptronix: Copper DBI Technology for 3D Memory Assemblies

Ziptronix: Copper DBI Technology for 3D Memory Assemblies

Product Description Copper DBI® technology is a patented low cost, scalable process technology that was licensed for 3D memory assemblies in December 2012. Copper DBI® technology offers higher throughput and better scalability when compared to copper thermo-compression bonding. This technology can be incorporated into die-to-die, die-to-wafer and wafer-to-wafer processes. Testimonial “There is... »

SET North America: ONTOS7 Surface Preparation System

SET North America: ONTOS7 Surface Preparation System

Product Description The ONTOS7 Atmospheric Plasma Surface Preparation Tool removes native oxides, residual organics or other bond-inhibiting films at atmospheric ambient prior to bonding.  Proven effective on many elemental metals and their alloys, this tool cleans and passivates bonding surfaces rapidly and safely without damaging critical layers. Testimonial To achieve high-density 3D IC, desi... »

Alchimer: eG3D Polymer

Alchimer: eG3D Polymer

Product Description Alchimer’s eG3D Polymer simplifies the metallization process flow for deposition processes for TSV insulation and barrier by combining the material properties of electrografting (eG) insulation and chemicalgrafting (cG) barrier technologies into a single step process. eG3D Polymer wet processes achieve favorable insulation and barrier properties at a reduced cost of ownership... »

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