Archives April 2013 - 3D InCites

Rudolph Acquires Assets of Tamar Technologies

Rudolph Acquires Assets of Tamar Technologies

Rudolph Technologies, Inc., known for its process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, has taken another step in expanding its capabilities for inspection and metrology in 3D packaging through the acquisition of selected assets, including a strong patent portfolio, relating to metrology capability from Tamar Technology, New... »

More than Moore and 3D IC:  Decoding the Code at the GSA Silicon Summit 2013

More than Moore and 3D IC: Decoding the Code at the GSA Silicon Summit 2013

There’s probably no more fitting venue for discussing future directions for processing and packaging technology in integrated circuit fabrication than the Computer History Museum in Mountain View, CA. After all, “The mission of the Computer History Museum is to preserve and present for posterity the artifacts and stories of the information age. As such, the Museum plays a unique role in the hi... »

tablets and smartphone

Reinventing the PC; MEMS and LEDs Grow Up

The PC world is dead?  Chris Hubbard, Intel’s Business PC Marketing Manager scoffs at the mere idea. “The demise of the PC industry was predicted before it was born!” he said during his opening presentation at the SEMI Americas Arizona Breakfast Forum, Friday April 12, 2013 at Intel in Chandler, AZ. Hubbard showed a chart contrasting PC revenue growth with different times over the years whe... »

Improving Communication Across Supply Chains Makes the Impossible Possible

Improving Communication Across Supply Chains Makes the Impossible Possible

Semiconductor supply chain, ecosystem, value chain: whatever you call it, its become a hot topic of discussion, and one that is near and dear to my heart as a supporter of 3D IC commercialization. Well over a year (maybe even going on two) we’ve been hearing suggested changes like a collaborative ecosystem, co-design and development, and a system level approach will help speed up time-to-market ... »

image courtesy of Future Fab International

2.5D Products and 3DIC Standards and Roadmaps Are On the Move

Naysayers be damned! Full commercialization for 3D ICs in smartphones may be a few years out, but that doesn’t dampen the spirits of the truly devoted, who latch on to every forward step as a monumental accomplishment. This week, progress appears to be taking off for 2.5D products, and the roadmaps and standards area are making notable progress. (If you can get excited about that, than you are a... »

3D stack courtesy of DARPA

Activity Heats up for 3D IC Chip Cooling

3D ICs have clearly caught the eye of the military and aerospace electronics industries. I came across two separate announcements – one from Georgia Institute of Technology and one from IBM Microelectronics – that each had been awarded DARPA grants to work on chip-level cooling technologies as part of the government agency’s Intrachip/Interchip Enhanced Cooling program (ICECool). According t... »

HMC Progress, More on Moore’s Law, and the GlobalFoundries’ Buzz

HMC Progress, More on Moore’s Law, and the GlobalFoundries’ Buzz

Not long after posting 3D IC Reality Check on Tuesday, I discovered that I missed one. If you haven’t read the post by SemiMD’s Mark Lepedus, Industry Inches Towards 3D Chips  you should. While its got some similar information about recent announcements from GlobalFoundries as was in Rick Merritt’s post in EETIMES, it has a much more optimistic spin. LePedus also gives a glimpse of ... »

Talking Points: Interconnectology, Inspiring a Paradigm Shift

Talking Points: Interconnectology, Inspiring a Paradigm Shift

At the BiTS Workshop 2013, the talk show segment, Talking Points, examined the concept of Interconnectology and how adopting new terminology can inspire a paradigm shift in the design and development of next-generation interconnect technologies, thereby impacting the semiconductor device manufacturing value chain. Hosted by Françoise von Trapp, 3D InCites, special guests included Scott Jewler, AN... »

3D IC Reality Check

3D IC Reality Check

The good news:  While forecasted dates for 3D IC volume manufacturing continues to be pushed out, clearly foundries and OSATS are gearing up to be ready when it does. The bad news: Forecasted dates for volume manufacturing of 3D ICs keep being pushed out.  Or do they?  Rick Merritt, EE Times, posted a detailed news analysis piece today titled 3-D IC stacks pushed back to 2015, that talks ... »

For Discussion: Is Wright’s Law a better Economic Index for 3D ICs than Moore’s Law?

For Discussion: Is Wright’s Law a better Economic Index for 3D ICs than Moore’s Law?

I just came across a slightly mind-blowing snippet in Forbes Magazine about a study conducted by MIT and Santa Fe Institute comparing the effectiveness of different forecasting methodologies for predicting how rapidly technology will advance. The study concluded that the two most accurate methodologies are the well-known Moore’s Law and lesser-known Wright’s Law. As we all know, the form... »