Archives January 2013 - 3D InCites

3D TSV Summiit

European 3D TSV Summit Interview: Gilles Fresquet

Fogale Nanotech has been on my radar with its 3D TSV metrology solutions ever since I noticed their booth last summer at SEMICON West. Sometimes it takes an occasion such as a pre-arranged interview at the European 3D TSV Summit for a connection to finally take place. I was happy to have such a moment last week, and sat down with Gilles Fresquet, to learn more about Fogale’s metrology solutions ... »

3D TSV Summiit

European 3D TSV Summit: Focus on Cost of Ownership

Now that the “technology bricks” for building 2.5D devices and 3D ICs have been essentially qualified, the focus has turned to optimizing them for improved cost of ownership (CoO).  At last week’s European 3D TSV Summit, in Grenoble, France, many of the supplier presentations demonstrated how their companies have been working to optimize qualified 3D TSV technologies across the process flow... »

3D ICs News in Brief – Jan. 19-29

3D ICs News in Brief – Jan. 19-29

While there is still a lot to report about the European TSV Summit, I wanted to catch everyone up on some recent developments at companies that have come my way via press release; beginning with the most recent: STATS ChipPAC and UMC announced that they have demonstrated the world’s first TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration. The companies re... »

3D TSV Summiit

European 3D TSV Summit: 3D TSVs Come of Age

Here I am, on my way back from Minatec Campus in Grenoble, France, where I attended SEMI Europe’s premiere European 3D TSV Summit. It was such a whirlwind few days, jam-packed with quality presentations demonstrating recent progress in all things TSV by the semiconductor manufacturing community and fabulous meals with industry colleagues and friends that this flight home is the first time I’ve... »

tablets and smartphone

3D App Update

Because someday soon, we will find more 3D TSV devices than just CMOS image sensors inside mobile applications, I like to keep my eyes and ears open for what’s going on in those areas. Here are a few interesting tidbits I came across lately. Forget what you heard about TSMC manufacturing the next A6 processor.  According to SemiWiki blogger, Daniel Nenni, this rumor is false! He says this is be... »

2013 Predictions for 3D ICs as told by Everyone – Part 2

2013 Predictions for 3D ICs as told by Everyone – Part 2

No sooner did I post last week’s curation of predictions for the semiconductor industry, and particularly for 3D ICs, than several more popped up online. I suspect this type of thing to continue for the next few weeks, and I will try and continue to cherry-pick the ones that made reference to 3D integration. In a Semiconductor Packaging News Viewpoint, Doug Goodman, CEO, Ridgetop Group, Inc. tal... »

Image Courtesy of brightsideofnews.com

Inside the Gadgets at CES 2013

One of these days, I’m going to go to CES. Since 3D integration technology isn’t the focus of the show, I’ve always just followed what other editors reported. But this year after flipping around the video of Qualcomm’s Paul Jacobs’ keynote address, I kind of felt like I missed out on something. One thing is for sure, while Jacob’s assumed a certain level of tech savvyness from the audi... »

2013 Predictions for 3D ICs as told by Everyone – Part 1

2013 Predictions for 3D ICs as told by Everyone – Part 1

It’s that time of year again when various electronics trade publications invite industry executives to peer into their crystal balls and make their predictions for the coming year. I’ve been perusing through everything from overall industry forecasts by market analysts to suppliers eager to promote their core competencies for 3D IC manufacturing. Here are some that especially caught my attenti... »

More Tech Notes from 3D ASIP 2012

More Tech Notes from 3D ASIP 2012

Oh yes, where was I before the holidays took over and hijacked my life for two weeks?  I’ll bet you thought I was done reporting on 3D ASIP, but wait – there’s more! Point/Counterpoint on Thin Wafer Handling I already reported on Wilfried Bair’s (Suss MicroTec’s perspective on temporary/ debond bonding here. EV Group has also been working to overcome the thin wafer handling hurdles... »

MonolithIC 3D's PDN concept f removing heat from 3D ICs.

Tying up 2012 3D IC Loose Ends

I don’t know about you, but I always find that amidst the holiday hubbub, the really important stuff gets shoved aside and falls through the cracks. Just in case you missed them, here are some good 3D related posts that may have been lost in the December race to “get it all done” so we could enjoy the holidays. On the topic of the 3D IC supply chain, SemiMD’s Mark LePedus wrote a comprehen... »