Archives November 2012 - 3D InCites

EV Group Completes Cleanroom Expansion, Opens New R&D Labs And Customer Training Center At Corporate Headquarters

EV Group (EVG) supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced the completion of its newly expanded cleanroom IV facility at its corporate headquarters in Austria. As part of the company's long-term growth strategy to address high-volume tool orders and speed time to market for its worldwide customer base, EV Group doubled its c... »

3D TSVs: Will Europe Lead the Way?

The first European 3D TSV Summit (January 22-23, 2013) hasn’t even happened yet, and already its intended message is becoming clear: Europe is ready to tackle those remaining issues and lead the world down the home stretch. It makes sense, since Europe’s R&D centers (imec, CEA Leti, Fraunhofer IZM) has been leading the way from the beginning, its foundries and IDMs (ST Microelectronics an... »

Introducing Interconnectology: A Call to Arms

In last week’s coverage of the Known Good Die Symposium, I talked about the notion of shifting focus from Known Good Die to Probably Good Die. It got me to thinking how by simply changing vernacular that we use, we can alter perspective and thereby affect a complete paradigm shift in the way we do things. For example, have you ever wondered why the term “advanced packaging” was coined to di... »

2.5D and 3D FPGA Update

Ever since TSMCs Open Innovation Platform (OIP) event, we’ve been hearing all about how the company has qualified its 2.5D chip-on-wafer-on-substrate (CoWoS) process flow, announced its test vehicle, and has begun shipping products. Indeed, at Roadmaps for Multi-die Packaging (November 14, 2012) Jan Vardaman used Altera’s adoption of the CoWoS test vehicle and design guidelines as an example ... »

TechSearch Celebrates 25 Years; Seeds Scholarship for Women in Engineering

TechSearch International, Inc. announces that in celebration of its 25th anniversary the company partnered with IEEE Women in Engineering Committee (WIE) to establish a scholarship for women going into the field of engineering.  The scholarship, named the IEEE Frances B. Hugle Engineering Scholarship, honors the memory of the distinguished engineer for whom the fund is named.  Frances Hugle gra... »

3D IC Blogosphere Update

After wrapping up a run of blog posts from two weeks of travel and 4 conferences,(IWLPC 2012, the IEEE 3D Test Workshop, and MEPTEC’s co-located Roadmaps to Multi-die Integration and Known Good Die Symposium) it’s time to catch my breath and see what else has been going on in the 3D blogosphere. From the looks of Phil Garrou’s SST post, I missed out on hanging with “many of the world's 3... »

“Known Good Die” has a new name

After 20 years of chasing elusive Known Good Die (KGD) to achieve high yielding advanced interconnect technologies, the semiconductor industry has come to the conclusion that its time to take a different approach. It’s called Probably Good Die, and when it comes to 2.5D and 3D ICs, particularly for Memory, it’s a means to an end. At Known Good Die 2012: Reducing Costs through Yield Optimizatio... »

Multi-Die Integration Provides Multifaceted Solutions

Multi-Die Integration Provides Multifaceted Solutions By Francoise von Trapp, 3D InCites  This year’s Roadmaps for Multi-Die Integration Symposium, hosted by MEPTEC on November 14, 2012 at the Biltmore Hotel in Santa Clara, CA, offered some interesting and different perspectives than the garden-variety 2.5D and 3D IC conferences of late. While there were a number of process-focused presentati... »

Coffee Break with Nicolas Sillon, CEA Leti

The day after Nicolas Sillon presented his keynote at IWLPC on interposer technology, we sat down to coffee and a one-on–one discussion about Leti’s accomplishments and position in the 3D space, and the upcoming European 3D TSV Summit, which takes place in Grenoble, January 22 & 23. Sillon has served on 3D InCites advisory board since it was first established, and I’ve visited Leti in G... »

IWLPC 3D Thursday: The Panel

It’s been a whirlwind of conferences these past few weeks, and as a result, I have attended FOUR panel discussions on 2.5D and 3D related topics. (I already wrote about the 3D Test Workshop Panel – 3D Buzz Hype or Reality. It’s stirred quite a discussion.) The day before I moderated that, I attended IWLPC’s 3D Panel: How did We Get Here? Where Do We Need to Go Now?  featuring the updates ... »

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