Archives July 2012 - Page 2 of 2 - 3D InCites

EV Group Unveils Its Next-Generation EVG150 Automated Resist Processing Platform for High-Volume Coating/Developing Applications

Redesigned, Fully Automated Modular System Integrates Unmatched Spray Coating Processes for MEMS, Compound Semiconductors and Advanced Packaging SEMICON TAIWAN, Taipei, September 4, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation EVG150 automated resist processing syste... »

Leti’s Open 3D Targets Niche Market Players

Last week, CEA-Leti launched its Open 3D initiative to the 3D world in an effort to make its mature 3D technologies accessible to industrial and academic partners for their advanced products and research projects. Wanting to learn more about this offer than was detailed in the press release, I interviewed Leti’s David Henry, Open 3D project manager. He not only provided answers to my questions, ... »

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