Archives June 2012 - 3D InCites

2.5D and 3D Messages Worth Repeating

I listened in on yesterday’s webcast, 3D and 2.5D Integration: A Status Report Live Event  hosted by Solid State Technology, and while most of the information was similar to what I had heard at IMAPS Device Packaging Conference, EDPS, ECTC 2012, etc., they are clearly messages worth repeating, and some new interesting nuggets as well. Jan Vardaman, from TechSearch International, started things »

June Event Highlights in 3D

Note to self: no more graduations/college orientations/vacations in the month of June. There are way too many events in 3D and I missed so much while I was off focusing on other things! Lucky for me, people writing and blogging about 3D technologies are coming out of the woodwork, and so as I catch up on my reading, I’ll point you to some of the key points made by my capable colleagues in the 3D »

Dow Corning and SUSS MicroTec Collaborating on Temporary Bonding Solution for Semiconductor Packaging

Dow Corning, supplier of advanced silicon technology and materials to the semiconductor industry, and SUSS MicroTec, supplier of semiconductor processing equipment announced a collaboration on a temporary bonding solution for 3D through-silicon via (TSV) semiconductor packaging. As part of this non-exclusive agreement, the companies are developing a material and equipment system solution for high ... »

We Interrupt this Hawaiian Vacation to Bring you 3D InCites Coverage of the IEEE VLSI Symposia on Circuits….

So here I am in Honolulu with my family, celebrating the return of my nephew from a 6 month deployment on a nuclear submarine, and I realize that the co-located IEEE Symposia on VLSI Technology and IEEE Symposia on VLSI Circuits is taking place at the SAME TIME, and there's a couple of sessions on 3D technologies!! So rather than joining my gang on a scuba diving adventure, I send them off to expl... »

More from Hot Chips 2012

So thanks to a couple tweets from Jim Prior (@cavemanjim) who’s blog post was included in last week’s Hot Chips curation, I was pointed to a couple of posts on SemiAccurate written by Charlie Demerjian, who covered the Xilinx tutorial featuring  AMD, Amkor, Xilinx Qualcom and UMC in two parts:  Hot Chips Talks about Chip Stacking, Good and Bad  and Die Stacking has Promise, and Problems.  ... »

Monday 3D Mash-up

For most of July I focused on coverage of SEMICON West in 3D.  Today, I thought I’d take a look at what else people were talking about in 3D space over the past few weeks. The Water Cooling IssueTwo bloggers took on the topic of water cooling 3D IC assemblies as a way to handle the heat. Brian Bailey got the ball rolling in his interview with Madhavan Swaminathan, who wears many hats in the 3D »

Ziptronix Takes on 3D Memory

After seeing the latest press release on Ziptronix foray into the memory space, I sought out Kathy Cook, business development manager at Ziptronix, at ECTC to get the full story.  We’ve been reading and hearing a lot about Ziptronix ZiBond process being used in CMOS image sensor (BSI) technology, and particularly in its recent partnership with Sony for CIS with backside illumination (BSI). Zi... »

STATS ChipPAC Introduces Scalable 3D eWLB Solutions

Semiconductor test and advanced packaging service provider, STATS ChipPAC Ltd. announced its next-generation three dimensional (3D) embedded Wafer Level Ball Grid Array (eWLB) Package-on-Package (PoP) solutions. This innovative new 3D technology provides an ultra thin package profile height below 1.0mm, a 30% height reduction over the industry standard 1.4mm total stacked package height. Market d... »

SUSS MicroTec launches platform for permanent wafer bonding, debonding and cleaning

SUSS MicroTec,supplier of equipment and process solutions for the semiconductor and related markets, launched the XBC300 Gen2, a high volume manufacturing platform for advanced 3D processing. The new bonding equipment can be used for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers. It is designed for production as well as process development. Configurable with a wide ... »