Archives March 2012 - Page 2 of 2 - 3D InCites

Is TSMC putting all its Eggs (or Apples) in one Basket?

For those of us who attended Doug Yu’s keynote address at the 3D Architectures for Semiconductor Integration and Packaging Conference in December, yesterday’s keynote at IMAPS DPC was, in the words of the immortal George Carlin, “déjà vu all over again”; driving home the message that yes, TSMC intends to provide full 2.5F and 3D service including chip design and fabrication, stacking and »

EV Group Unveils Next-Generation Temporary Bonding and Debonding Platform for High-Volume 3D IC Manufacturing

Enhanced Hardware, Software and Process Control Capabilities Enable Two-fold Increase in Throughput to Meet Productivity and Yield Requirements of Today’s 3D IC Manufacturers  St. Florian, Austria, July 3, 2012 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®850TB/DB automated te... »

The Psychology of 3D Integration

Long before he set out on the 3D Holy Grail, Herb Reiter had other pursuits that involved bringing new technologies to market. Most notable is his work with field programable gate arrays ( FPGAs) and application specific ICs (ASICs), which, according to Reiter, actually started out as customer specific ICs (CSICs). Therefore, Herb has some reference points to draw from that I lack. So I regularly ... »

3D Panel Discusses the Evolving 2.5D/3D Infrastructure

Here’s something new from previous Device Packaging Conferences – rather than a panel largely populated by members of the EMC3D Consortium (ie: suppliers) moderated by either Jan Vardaman or Phil Garrou, the panel was populated by foundry and OSAT representatives, a fabless company, a market analyst, and  still moderated by Phil Garrou. Specifically, the panelists included Doug Yu TSMC; Jon G... »

IMAPS Device Packaging Conference Through 3D Glasses – Day 1

It’s going to be a busy 3D week here at IMAPS Device Packaging Conference, in Scottsdale AZ. So I’m going to attempt to keep up with everything with short, daily blog posts.  I can’t promise to cover everything in detail (hey, if you wanted that, you should have come yourself!) As I’ve said in the past, if you attend a number of conferences each year on a topic, you tend to hear a lot of ... »

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