Archives March 2012 - 3D InCites

Amkor Technology Licenses Proprietary Through Mold Via Technology to SHINKO

Amkor Technology, Inc. provider of semiconductor packaging and test services, has granted SHINKO Electric Industries Co, Ltd. a non-exclusive license to its proprietary Through Mold Via (“TMV®”) technology. The agreement provides for the transfer of Amkor’s TMV® technology to SHINKO and a license under Amkor’s patents to enable SHINKO to manufacture packages based on this technology. The »

At Fraunhofer IZM-ASSID, It’s All Silicon, All the Time

One of 60 research institutes that make up Germany’s Fraunhofer Gesellschaft, the Fraunhofer Institute for Reliability and Microintegration IZM is known worldwide for its work in the realm of microelectronic packaging and system integration. The center ASSID (which stands for All Silicon System Integration Dresden) was established as a division of Fraunhofer IZM with the core mission of developi... »

MonolithIC 3D Inc.’s 2D and 3D-ICs Simulator Tool is a Worldwide Hit

MonolithIC 3D Inc., a Silicon Valley startup specializing in 3D ICs, announces a milestone with its 2D and 3D ICs simulator tool. Industry professionals from 35 countries across the globe have downloaded the tool directly from the company’s website over 240 times. The MonolithIC 3D team has developed the open-source simulator called IntSim v2.5 to help study scaling trends and optimize chip powe... »

Himax Technologies Selects EV Group to Expand Production Capacity for Wafer-Level Optics

Repeat Order for IQ Aligner Further Solidifies EVG’s Position as Leading Microlens Molding Solutions Provider for Wafer-level Camera Applications  St. Florian, AUSTRIA, March 27, 2012 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Himax Technologies, Inc., a leading producer of CMOS ... »

EV Group,Triple I at Work: The Sequel

Two years ago, I visited EV Group’s world headquarters in Schärding, Austria, and wrote about what they call their Triple I approach to success. Triple I stands for Invent, Innovate, Implement, and refers to EVG’s mission of getting into whatever market they target at the ground level, investing 20% of its revenue in R&D, and working alongside customers to bring new technologies to marke... »

Glass vs. Silicon Interposers for 2.5D and 3D IC Applications

There has been enough interest stirred up in R&D around glass as a low-cost alternative interposer substrate material compared with silicon, that there was an entire session dedicated to developments in that area at the 2012 IMAPS International Device Packaging conference, held March 5-8 in Scottsdale, AZ.  Rao Tummala, of Georgia Tech’s 3D Packaging Center, started things off, touting th... »

SUSS MicroTec launches RCD8: The new Resist Coat and Develop Platform

SUSS MicroTec, a supplier of equipment and process solutions for the semiconductor and related markets, launched the RCD8, a new manual Resist Coat and Develop Platform for substrates. The new platform  is said to offer a high application variety coupled with low investment costs as well as an easy transfer of processes from the RCD8 manual platform to a SUSS MicroTec production tool. The RCD8 i... »

NEXX Systems Joins Tokyo Electron (TEL) as a Wholly Owned Subsidiary

Tokyo Electron Limited announced the completion of a definitive acquisition agreement with NEXX Systems Inc. Over the years, NEXX collaborated with TEL to study process technology in advanced packaging equipment for the development of 3D Thru Silicon Vias (TSV), giving both companies an opportunity to work together and setting the stage for TEL's acquisition of NEXX. Rapid growth of smart phones, »

Shin-Etsu Microsi Joins EV Group’s Open Platform for Temporary Bonding Materials for 3D IC Manufacturing

New Platform Member Further Strengthens Supply Chain for EV Group’s New ZoneBOND™ Capable EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) Equipment Modules EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shin-Etsu Chemical Co., Ltd., the world’s largest supplier of semiconductor »

Applied Materials and A*STAR’s Institute of Microelectronics to Drive Advanced 3D Chip Packaging with World-Class R&D Lab in Singapore

Applied Materials Inc. and the Institute of Microelectronics (IME), a  research institute under the Agency for Science, Technology and Research (A*STAR), officially opened the Centre of Excellence in Advanced Packaging at Singapore's Science Park II today. Singapore's Minister for Trade and Industry, Mr. Lim Hng Kiang, presided at today's opening ceremony.The Centre of Excellence in Advanced Pack... »

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