Archives October 2011 - 3D InCites

Rest in Peace, Steve Adamson

Once again I find myself using this blog space to venture outside the scope of normal coverage to offer some thoughts and condolences on the passing of one of our industry’s own – Steve Adamson, Marketing Manager at Asymtek, who lost his battle with pancreatic cancer last Friday evening, Oct 28 only weeks after having been awarded IMAPS Daniel C. Hughes Award, which recognizes those who have m... »

EV Group Launches ZoneBOND™ Capable Equipment and Open Platform for Temporary Bonding Materials

EVG's EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) Modules Enable Flexible Choice of Adhesives  ST. FLORIAN, Austria, October 26, 2011 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched a suite of groundbreaking temporary bonding and debonding (TB/DB) equipment modu... »

MEMS Executive Congress 2011 to Showcase the Coolest in MEMS Applications

Are you going to this year's MEMS Executive Congress? I was invited, but unfortunately won't be able to attend. I'm sad about that - it was a great event last year and I learned alot about the synergies between MEMS and 3D ICs. As you probably know, MEMS are already 3D by design. By themselves the can't do much, and need to be connected to an IC to function; a recent goal here is to use an IC as a »

Brewer Science and EV Group Announce Agreement on ZoneBOND™ Technology

Enabling Commercialization of Groundbreaking Temporary Bonding and Debonding Technology ROLLA, MO, USA and st. florian, AUSTRIA, October 20, 2011 – Brewer Science, Inc., a global leading innovator and manufacturer of specialty materials, process solutions, and equipment for the microelectronics industry, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the M... »

Perspectives on 3D Integration: The Researchers

To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for technology that rivals no other; except perhaps that of Rao Tummala of Georgia Tech.  But John is definitely more vocal in his passion. Rao has a softer, gentler approach.  At this year’s IWLPC in Santa Clara, both expressed their perspectives on what they see as the most cost effective ... »

2.5D and 3D Supply Chain Solutions – is there only one?

I had a bit of an “aha!” moment yesterday at the MEPTEC 2.5D, 3D and Beyond Conference, with regard to the whole supply chain conundrum that seems continues to be part of the 3D commercialization hold-up. After listening to Sunil Patel of GlobalFoundries and Rich Rice of ASE discuss their respective companies’ game plans, it hit me.  Perhaps there IS more than one way to skin this particula... »

EV Group and Fraunhofer IZM-ASSID Establish Joint Development Agreement for High-Volume 3D Integration Applications

JDA to Extend Limits of Temporary Bonding/Debonding Technology to Support High-Topography Wafers and Chips  SEMICON EUROPA, Dresden, Germany, October 11, 2011—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established an agreement with world-renowned research institute Fraunhofer »

Inspiring the Semi Industry’s New Frontier

Last week I attended SEMICO’s Research Summit, in Scottsdale, AZ, and was fortunate to hear some high-level industry executives discuss the emerging landscape of the semiconductor industry, and 3D integration’s role in it. What was most interesting was the resounding call across the board for collaboration across the supply chain, as well as new approaches to address this new frontier that inc... »

Who Wins With 3D Stacking?

In this editorial commentary, blogger Ed Sperling, of the Low Power Engineering community, talks about the opportunities 3D stacking technologise pose for EDA start-ups and vendors. There seems to be little doubt that the semiconductor industry is moving to 3D stacking. It’s simply too expensive for most companies to develop SoCs at advanced nodes from scratch when they can use existing ... »

Alchimer Appoints Chief Operating Officer

Alchimer S.A. provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, has named Erik C. Smith chief operating officer. Smith has nearly 25 years of experience in the semiconductor industry in the U.S. and Asia, including five years as president and COO of Qcept Technologies, a manufacturer of inspection systems f... »