Archives August 2011 - 3D InCites

GLOBALFOUNDRIES and Amkor to Collaborate on Advanced Assembly and Test Solutions

GLOBALFOUNDRIES and Amkor Technology, Inc. have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes. The companies plan to collaborate to co-develop and commercialize integrated fab-bump-probe-assembly-test solutions aimed at multiple customers and end-market applications and expand their lead-free bump licensing relationship. Through »

Georgia Tech’s 3D Interposer Technologies Provide Low-cost 3D Option

At SEMICON West 2011, Prof. Rao Tummala of Georgia Tech presented the unique glass and silicon-based 3D Interposer technologies being developed at Georgia Tech, claimed to be simpler and cheaper than 3D ICs with TSV for many mobile and consumer applications at SemiconWest 2011.  in his presentation, Tummala discussed the primary differences and challenges between traditional industry's approach t... »

NEXX Celebrates 10 Years of Success

NEXX Systems' 10th Anniversary celebration dawned sunny, warm and dry, a rare occurrence these days in the Northeast. In fact, the company was taking quite a risk to plan an outdoor celebration, regardless of the tent. But that pretty much describes the company’s overall approach to business, and why they’ve achieved such success in such a short time. They take risks and so far, those risks ha... »

Shanghai Simgui Technology Places Follow-on Order for EVG Wafer Bonder; Advances to Fully Automated SOI Wafer Production

ST. FLORIAN, Austria, November 8, 2011 — EV Group (EVG) , a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shanghai Simgui Technology Co., Ltd. (Simgui), a leading Chinese wafer manufacturer, has placed a follow-on order for an EVG850 automated production bonding system  for silicon-on-insulator (SOI) and »

CEA-Leti: The Mother Ship Re-visted

Last time I visited Leti on the Minatec Campus was in October 2009.  Recently, when I was back for Leti’s Annual Research Reviews, Mark Scannell, head of the 3D integration program, took me on another tour. A lot has been going on here in the past 2 years. For one thing, the building I saw going up in its early stages has been completed.  There’s now a showroom displaying all the nifty »

TSV Supplier ALLVIA Attains ITAR Registration

Through-silicon via (TSV) foundry,ALLVIA, has received official International Traffic in Arms Regulations (ITAR) registration from the U.S. Department of State, Bureau of Political-Military Affairs. The registration certifies the company's dedication as a trusted U.S. facility to adhering to regulations that control the export and import of defense-related products and services. “We now see the »