Archives June 2011 - 3D InCites

Pistorio for President

If anyone could give President Obama a run for his money in 2012, I think it might just be Pasquale Pistorio, honorary chairman of ST Microelectronics.  He's worked with the company since its establishment in 1987 until his retirement in 2005. During his closing remarks at Leti's Annual Research Reviews on Monday, I sat, nodding in agreement and typing madly to capture every word. He was THAT goo... »

Will write for Lobster…. Day One of Leti’s Annual Research Reviews

Take note everyone in charge of event planning: Léti really upped the ante last night at their Annual Research Reviews Gala event, held outside of Grenoble at the lovely Hotel Chavant.  While attendees sipped wine and socialized on the outdoor terrace under a green canopy of Chestnut trees adorned with twinkle lights, servers circulated a steady stream of French delicacies from Fois Gras, to Coq... »

EV Group Adds In-Line Metrology Capability to Wafer Bonding Systems to Support High-Volume 3D-IC and TSV Manufacturing

First-ever Integration of In-line Metrology with Temporary Bonding/Debonding Enables More Repeatable and Reliable Process, Improved Yields and Lower Cost of Production ST. FLORIAN, Austria, June 21, 2011 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new in-line metrolog... »

My Day At SEMI High Tech U

A few weeks ago, I got an email from Marie LaBrie at MCA Public Relations, asking whether my daughters might be interested in participating in the Phoenix AZ session of SEMI High Tech U, sponsored this year by EV Group, ON Semiconductor, ASML and the Fab Owner's Association.  It sounded like fun, and I encouraged the girls to give it a shot, only to get an unenthusiastic eye roll. Technology geek... »

ECTC 2011 – It’s a Small World After All

I ask you, could there be a better place to host a conference dedicated to micro and nano electronics than Disney World, the place where all things are possible? This year’s event boasted the greatest turnout so far, (over 1000 attendees) and had such an abundance of papers that the committees could be highly selective in the ones they chose, ensuring a ‘cream of the crop’ technical agenda, ... »

A*STAR Institute of Microelectronics and Tezzaron Team Up to Develop 2.5D/3D Through-Silicon Interposer Technology

The A*STAR Institute of Microelectronics (IME) and Tezzaron Semiconductor, a leader in 3D-ICs, have today announced a research collaboration agreement to develop and exploit advanced Through Silicon Interposer (TSI) technology. The two organizations will improve and refine the design and manufacture of silicon interposers and work to standardize the process, flows, and process design kits (PDKs). ... »

Tribute to Steve Jobs: 1955-2011

  Today is a sad day in the high tech industry. The news of the death of Apple Founder, Steve Jobs, rippled through the the cocktail reception at IWLPC faster than a 4G download. He was a visionary. He changed the world. Plain and simple. This quote, from his commencement speech at Stanford, in 2005, sums up the amazing man that he was. "Your time is limited, so don’t waste it living someone ... »

Alchimer Discloses Major TSV Barrier Film Advance

A new film-deposition technology advance from Alchimer S.A.is said to cut fill deposition times and could provide new options for the electronics packaging industry as it struggles to bring through-silicon vias (TSVs) into cost-effective production. Alchimer has disclosed that its AquiVia TSV barrier-layer process has the ability to provide uniform, guaranteed 100% step coverage over complex sili... »

Imec and Cadence Deliver Automated Solution for Testing 3D Stacked ICs

Imec and Cadence Design Systems, Inc. have announced new technology that delivers an automated test solution for design teams deploying 3D stacked ICs (3D-ICs). The technology addresses the test challenges involved as electronics companies increasingly turn to 3D-ICs as a way to increase circuit density and achieve better performance at lower power dissipation for mobile and other applications whe... »

Cascade Microtech Partners With imec for 3D-TSV Probe Solutions

Semiconductor test manufacturer, Cascade Microtech, Inc. and imec have entered into a collaborative research partnership for testing and characterization of 3D integrated circuit (IC) test structures. Imec will work closely with Cascade Microtech to develop test methods and methodologies for emerging 3D Through-Silicon-Via (TSV) structures, and to lead the way in development of global standar... »