Archives May 2011 - 3D InCites

Alchimer’s Technology Breakthrough Brings Tomorrow’s Solutions to Today’s Applications

Alchimer’s latest technology breakthrough is an interesting twist on the way semiconductor solutions generally presents themselves. We’re used to hearing about scaling that goes from bigger to smaller. This is the first time I’ve heard of a technology that scales UP to meet application needs. But that’s precisely the differentiation between Alchimer’s flagship suite of wet deposition pro... »

Altera joins imec’s advanced CMOS scaling program for 3-D process technology development

Imec has entered into a three-year research collaboration with Altera Corporation to develop advanced CMOS scaling technologies. Altera joins a growing number of fabless semiconductor companies that are part of imec’s INSITE program, which provides member companies insight into near-term and future IC technology options. The initial collaboration between imec and Altera will focus on the develop... »

Alchimer Product Extension Provides Metallization For Interposer and Via Last in 3D Packaging

Alchimer, provider of nanometric film deposition for advanced 3D packaging applications as well as semiconductor interconnects, MEMS and other electronic technologies, announced a new wet-deposition process, AquiVantage, that grows interconnect layers for interposer redistribution layers (RDLs) and significantly enhances via-last backside wafer interconnects. AquiVantage uses the same cost-saving »

Imec and Atrenta Develop Exploration Flows for 3D ICs

Atrenta Inc., provider of SoC Realization solutions for the semiconductor and electronic systems industries, in collaboration with imec’s 3D integration IIAP (industrial affiliation program), announces the development of an advanced planning and partitioning design flow for heterogeneous 3D stacked ICs. Imec and Atrenta will be demonstrating this flow at the Design Automation Conference (DAC) in »

Doing Well by Doing Good

There are times when I venture outside the scope of coverage of 3D InCites to blog about something I find equally compelling. Today is one of those days.  At the  SEMICO Research Summit in Scottsdale AZ last week, Bob Krysiak, executive VP of ST Microelectronics talked about the company’s commitment to “doing well by doing good”; focusing on products that enhance human productivity, data s... »

SUSS MicroTec launches XBS300, the next generation Temporary Bonder for 200mm and 300mm High-Volume Production

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBS300 Temporary Bonder, SUSS MicroTec's latest generation of high volume manufacturing temporary bond systems. This Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well as other processes that require thin wafer handl... »

EV Group Boosts High-Volume Manufacturing Performance Across Product Lines With New XT Frame Equipment Platform

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings.  Specifically designed to address new requirements from »

Applied Materials Introduces Technology to Enable Advanced Image Sensors for Smartphones

Applied Materials, Inc. announced its new Applied Producer®OptivaTM CVD system that enables the manufacture of state-of-the-art, backside-illuminated (BSI) image sensors used in the most advanced smartphones, tablet PCs and high-end cameras. The innovative Producer Optiva system is uniquely capable of depositing low temperature, conformal films that boost the low-light performance of the sens... »

Brewer Science and SUSS MicroTec Jointly Commercialize ZoneBOND™ Technology for Thin Wafer Handling

Brewer Science, Inc., the inventor of ZoneBOND™ technology and world leading expert in materials and processes for thin wafer handling, and SUSS MicroTec, a leading supplier of equipment, are joining forces in commercializing ZoneBOND™ technology for thin wafer handling. SUSS MicroTec, market leader in room temperature debonding process equipment, is now offering the Brewer Science ZoneBOND... »

Alchimer’s Taiwanese Expansion Emphasizes Total Solution Strategy

Last week’s announcement of Alchimer’s expansion into Taiwan via its Representative agreement with Kromax International Corp. further exemplifies the company’s strategy to provide not only a disruptive process, but the infrastructure with which to execute. Kromax is a Taiwanese company that represents semiconductor and flat-panel equipment manufacturers and material suppliers in the Asian ma... »