Archives December 2010 - 3D InCites

Our Baby’s All Grown Up!

I just read Mark LePedus’ (EE Times) coverage of the 3-D Architectures for Semiconductor Integration and Packaging last week in Burlingame, and I was wondering if we’d both been at the same event, or was he just not paying attention?  TSV not ready to for prime time? I beg to differ. While I concur that Synopsys’ Antun Domic did a good job painting this particular picture for 3D TSVs; I wo... »

Alchimer and Nagase & Co Sign Exclusive Agreement

Alchimer S.A, provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, is extending its presence in Japan under terms of a new agreement with the Nagase ChemteX unit of Tokyo-based Nagase & Co., Ltd. The new agreement, which expands a relationship dating back more than a year, gives Nagase ChemteX, which is h... »

EV Group Introduces Industry’s First Fully Automated Wafer Bonding System for HB-LED Manufacturing

EVG560HBL Significantly Increases Throughput for Volume HB-LED Production »

EV Group and the Institute of Microelectronics in Singapore Partner to Advance Through-Silicon Via Process Development

ST. »

CEA-Leti Building Europe’s First 300mm R&D Line Dedicated to 3D-Integration

CEA-Leti has opened a complete 300mm fab extension dedicated to 3D-integration applications. Final equipment installations will continue through to the end of this year with an inauguration event planned in January, 2011. »

SPTS Begins 2010 with Solid Q1 Shipments of US$40M

SPP Process Technology Systems Ltd. (SPTS), announced shipments of US$40 million during the first quarter of 2010. SPTS was formed in October 2009 to merge Surface Technology Systems plc (STS) and assets acquired from Aviza Technology, Inc., including the single wafer process equipment subsidiary Aviza Technology Ltd. »

New era calls for new strategies

I’ve always been good at connecting the dots. I find it easier to understand a novel concept if I can apply it to something I already know about. »

Rudolph Technologies receives orders from STATS ChipPAC for eWLB Inspection

Rudolph Technologies, Inc. announced it has received multiple orders for its NSX® and WaferScanner™ Inspection Systems from STATS ChipPAC Ltd. The systems will be used for high-throughput inspection during each step of the eWLB (embedded wafer-level ball grid array) process. Shipments commenced in 4Q09 and will continue through 1Q10. »