Archives October 2010 - 3D InCites

Atrenta and CEA-Leti Sign a Multi-Year Collaboration Agreement

Atrenta Inc., provider of Early Design Closure® solutions that improve design efficiency throughout the IC design flow, has signed a multi-year collaboration agreement with CEA-Leti.The joint development work defined in the collaboration agreement will take place at Atrenta’s R&D center in Grenoble. “3D design and advanced power reduction represent two areas of significant interest for ... »

A Neophyte in Tokyo

Just arrived in Tokyo – my first visit to Asia ever.  I’m here at the invitation of Paul Werbaneth, of Tegal Corp. to attend a one-day seminar on TSV etch on Tuesday. ( I mentioned this in last week’s 3D InCites InBrief, but the agenda has slightly changed.  Presenting companies now include Tegal, SPTS, Panasonic, Hitachi and a professor from the University of Tokyo.) I’m sure many (mayb... »

3-D chips and Evolving Test Strategies Take Center Stage at ITC

Program chair Erik Volkerink of Verigy discusses this year's International Test Conference in an interview with Rick Nelson, Chief Editor, Test and Measurment World. The testing of 3-D chips, protocol-aware test, and concurrent test will be key topics on the agenda of the 41st International Test Conference October 31 through November 5 in Austin TX. While the test of 3-D chips was a key focus at ... »

An In-Depth Look at Leti’s Common Lab with SPTS

When a research institute is evaluating different options for technology partnerships, what tips the scales in favor of one supplier over another? In the case of the recently announced common lab agreement between Leti and SPP Technology Process Systems (SPTS) to further develop processes for high aspect ratio TSVs, it was a matter of finding the ideal mix of key elements that included an establis... »

Imec sets up R&D activity in Taiwan

Imec Taiwan has signed the co-funding contract with the Taiwanese Ministry of Economic Affairs (MOEA) for its R&D activity Imec Taiwan Innovation Centre (ITIC). ITIC’s goal is to expedite applied research projects with industry and academia that will result in electronic designs, components and technology solutions. The new R&D centre will focus on a variety of innovative applications ... »

EVG Unveils EVG520L3 Next-Generation Wafer Bonding System with Key Cost-of-Ownership Advantages for Advanced Packaging and MEMS

New wafer bonder from EVG enables 3-5x throughput improvement for breakthrough cost-of-ownership performance   SEMICON EUROPA, Dresden, Germany, October 19, 2010 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest addition ... »

Munich’s Fraunhofer Institute Comes Full Circle

Ever since I interviewed Jürgen Wolf, manager of Fraunhofer IZM All Silicon System Integration Dresden (ASSID) about the Dresden-based institute’s 3D program, I’ve been meaning to also catch up with Peter Ramm, head of the silicon technology and vertical system integration department at the Fraunhofer EMFT (formerly IZM-M) to compare notes. Up until July 2010, the Fraunhofer’s 3D program ha... »

EV Groups’s Gemini Wafer Bonder Selected by MEMS Pioneer Sensonor for High-Volume Production of Thermal Imaging Devices

Order from Sensonor Enables EVG to Leverage Decades-long Expertise in Wafer Bonding to Support Emerging, High-growth MEMS Market SEMICON EUROPA, Dresden, Germany, October 18, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its GEMINI® fully automated wafer ... »

Alchimer in Asia: Things are Cooking

I caught up with Alchimer CEO, Steve Lerner last week at the IWLPC in Santa Clara, to find out how things have progressed since news of Panasonic Investment Partners’ equity investment in the company back in July. It turns out setting up shop in Asia has been a great strategic move for the start-up. Last week’s announcement of the Alchimer’s licensing agreement with Nagase ChemteX unit of To... »

Is the Bloom off the 3D TSV Rose?

So I’m sitting here back at my desk, sifting through my pile of notes from this week’s adventures at the 2010 International Wafer Level Packaging Conference in Santa Clara, CA, trying to figure out what to write about first. Between chairing sessions, conducting interviews, attending keynotes and panels, and just generally catching up with everyone, my head is once again crammed with informati... »

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