EV Group Installs its Wafer Cleaning System for Compound Semiconductor Research at the University of Tokyo
EVG System Enables Void-free Wafer Bonding of III-V Compound Semiconductor Materials on Silicon Wafers with High-quality Surface Preparation TOKYO, JAPAN, September 29, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor markets, today announced it has received an order from the University of Tokyo for its EVG301 megas... »
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