Archives September 2010 - 3D InCites

EV Group Installs its Wafer Cleaning System for Compound Semiconductor Research at the University of Tokyo

EVG System Enables Void-free Wafer Bonding of III-V Compound Semiconductor Materials on Silicon Wafers with High-quality Surface Preparation TOKYO, JAPAN, September 29, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for MEMS, nanotechnology and semiconductor markets, today announced it has received an order from the University of Tokyo for its EVG301 megas... »

Progress is Progress in the Medical Device World

This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when it came to technology advancements themselves, I noticed that not much exciting has happened since last year. Or maybe I’ve just been spoiled.  Not every year can be about earth-shattering technological breakthroughs. This was the year about continuing progress of the breakthro... »

Going the Distance in Medical Electronics

Every once in a while it helps to step back and take a look at the big picture. For me, attending events like this week’s 2010 Medical Electronics Symposium, co-hosted by MEPTEC and SMTA, is one way to do that.  This year’s theme was Successful Strategies for the Medical Electronics Sector, so although 3D and MEMS technologies were addressed in a few of the presentations (I’ve addressed tho... »

EV Group Strengthens Presence in Middle East with Order Win from King Abdullah University of Science and Technology

Top university selects EVG systems on strength of flexible technology, local service and support ST. FLORIAN, Austria, September 23, 2010 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has shipped an EVG520IS semi-automated wafer bonding system and two EVG6200 automated alignment systems »

The Inside Scoop from GSA’s EDA 3D/TSV Interest Group

Guest contributor, Herb Reiter, reports from the Sept 13 meeting of the GSA’s 3D/TSV EDA Interest Group, where 55 attendees, both physical and virtual, heard 3D progress reports from academia, manufacturing, and market research entities. For those of you who missed it, Herb provided the following minutes of the meeting: Herb Reiter opened with encouraging news about continued IC revenue growth »

Amkor Sets the Bar with Fine-Pitch Cu Pillars

I love field trips. This week, I took one over to historic old town Chandler, AZ, where IMAPS Arizona chapter was hosting a luncheon event at the Crown Point San Marcos Resort. (A year and a half in nearby Mesa, and I had never been beyond Chandler’s industrial parks.) I have to say, Amkor’s Lee Smith did a stellar job organizing this successful event. An impressive collection of table top ... »

STATS ChipPAC Celebrates Grand Opening of 300mm eWLB Facility

The official inauguration of STATS ChipPAC’s 300mm eWLB facility was held September 15, at the company's Yishun facility in Singapore with more than 150 local dignitaries, customer representatives, business partners and management participating. In April of 2010, STATS ChipPAC established itself as the first in the world to implement 300mm eWLB wafer manufacturing capabilities. STATS ChipPAC’... »

EV Group: “Triple I” at Work

It’s a good story that’s been 30 years in the making. From its founding by Erich and Aya Maria Thallner in 1980 and subsequent launch of the world’s first double-sided mask aligner for the emerging MEMS market five years later; to its most recent industry-first launch of a fully-automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing; EV Group has adhe... »

Prior Predictions

Every once in a while, it’s helpful to step back and get a broad view of what’s going on in the world of packaging as a whole to get a better idea of how much impact 3D has. In this morning’s opening keynote at the IMAPS Device Packaging Conference, Prismark Partners’ Brandon Prior did just that; offering a comprehensive snapshot of the 3D packaging landscape. »

Alchimer opens 300mm facility in Asia

Alchimer announced the opening of a new applications-and-development facility in Seoul, South Korea, for demonstration of its innovative processes on 300mm wafers. The facility will begin accepting customers’ wafers in April. »