Archives July 2010 - Page 2 of 2 - 3D InCites

SEMI International Standards Program Forms 3D Stacked IC Standards Committee

SEMI announced today the formation of a Three-Dimensional Stacked Integrated Circuits (3DS-IC) Standards Committee. 3DS-ICs are composed of a stack of two-dimensional die, and are viewed as critical in helping the semiconductor industry keep pace with Moore’s Law. Current integration methods like wirebond and flip chip have been in production for some time, but the next generation of 3D integrat... »

TSVs: Emerging No Longer

What makes something an emerging technology, and what makes it near-term?  I asked this question of the IEDM technical committee at the press luncheon, because I had noticed in Kinam Kim’s talking points for his plenary talk that TSV was a separate line-item from emerging technologies.  The response was that according to IEDM’s classification, an emerging technology was one that would n... »

austriamicrosystems Introduces “More Than Silicon” Initiative

austriamicrosystems Full Service Foundry business unit today introduced its “More Than Silicon” initiative, a comprehensive service and technology package that is said to go beyond industry standard foundry services. Foundry customers are expected to benefit from access to leading edge technology add-ons, advanced packaging services and dedicated support engineers to enable first-time-right de... »

Queen of 3D meets King of Flip Chip

It’s not often that I get to meet other members of the semiconductor aristocracy, so I was delighted to recently find myself in the company of Datacon’s Hugo Pristauz, the King of Flip Chip. »

Dr. Bill Bottoms joins Alchimer Board

Alchimer S.A., provider of nanometric deposition technology for semiconductor interconnects and through-silicon vias, announced today that W. R. (Bill) Bottoms, a veteran chip industry executive, investor and entrepreneur, has joined its board of directors. »

IITC Technical Conference Expands Program to include 3D Memory

A new industry emphasis on 3D memory technology has prompted the 2010 IEEE International Interconnect Technology Conference (IITC) to expand the conference's technical program with a session on alternative back-end memory technologies. »

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