Archives May 2010 - 3D InCites

Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufac

EVG Systems Selected for Platform Flexibility, Functionality and Industry-Proven Reliability »

New Realities for TSV Processing

In this article, published in the May/June 2010 issue of Chip Scale Review Magazine, Steve Lerner, CEO, Alchimer, proposes a "variation on theme" for TSV cost-of-ownership. 3D integration and More-than-Moore are popular topics in the semiconductor industry, with »

OSEO assigns 9M Euro to support CUIVRE Project

Smart Equipment Technolgy (SET), Replisaurus Mastering, and research partner, »

A 3D Field of Dreams

If you build it, they will come. That’s the message Ray Kinsella heard in the movie, Field of Dreams. I think of that a lot as 3D InCites grows into the community we first envisioned almost a year and a half ago. »

Passing of the Baton

I received a press release from MCA Public Relations today announcing the new leadership team, in light of the sudden and tragic loss of the company’s founder and CEO, Jean LeMoin. Traditional trade publication protocol would call for me to note such news, but not necessarily announce it. »

SEMICON Singapore program features 3D InCites Partners

SEMICON Singapore gets underway next week (May 19-21), and the 3D track speaker line-up features presentations by several 3D InCites partners. If you plan on attending, be sure to put these sure-to-be interesting talks on your personal agenda. »

SEMICON West to address critical trends in 3D IC and Advanced Packaging

The SEMICON West 2010 show at Moscone Center in San Francisco, from July 13-15, will present a full program of exhibitions, presentations, meetings, and workshops focused on 3D interconnects (3D IC) for integrated circuits. »