Archives February 2010 - 3D InCites

3D Discussion Topics: Looking for Member Input

I’ve been waging a campaign this week to bring in new members by contacting all the members of the TSV 3D Packaging Group on LinkedIn individually; the rationale being that anyone participating in LinkedIn groups is really motivated to actively participate in discussions. Well, so far it’s working. »

Successful 3D Integration takes more than new technologies

In last week’s discussions in the design space — Is TSV a wire or a device? »

Designers add their voice to the 3D integration journey

After being immersed in the 3D design world over the past few weeks I realized a few fundamental differences between design engineers and process engineers. Now you, as a reader, may be thinking that I’m pointing out the obvious. But the point is, as 3D processes – and particularly through silicon vias (TSV) – attract the attention of the design community, different perspectives surface. »

Wafer-Level Microlens Molding Process From EV Group Extends Manufacturing Roadmap for CMOS Image Sensors

EV Group (EVG), supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it has developed a new micro-lens molding process that can enable volume production of very-high-resolution (up to eight megapixels and higher) wafer-level optics for use in smart phones, pico projectors and myriad other applications.  The new Monolithic Lens ... »

Alchimer’s Electrografting Validated by RTI

Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias (TSVs), semiconductor interconnects and other electronic applications, announced that its Electrografting (eGTM) technology has been validated by scientists at RTI International (RTI). RTI presented its research findings at the IEEE 3D System Integration Conference (3DIC) in Munich, Germany, confirming that ele... »

SPTS: A Wild Ride to Success

A year ago, things weren’t looking so great for Aviza Technologies. According to Kevin Crofton, executive VP, SPTS and managing director of the UK division, the company was in Chapter 11, mainly because its thermal division in Scotts Valley was heavily DRAM focused and was deeply affected when that market collapsed. Then to add fuel to the fire, Qimonda, one of its main customers, went i... »

3D InCites’ Guide to Navigating theThird Dimension at SEMICON West

There’s no doubt about it, the 3D technology related workshops, lectures, and presentations happening at and around SEMICON West this year are plentiful and varied. There’s something for everyone: 3D metrology, 3D interconnect and standards development; 3D IC co-design, 3D bonding and thin wafer handling, 3D test solutions, commercialization of TSV and cost of ownership, supply chain conside... »