Archives January 2010 - 3D InCites

SUSS MicroTec sells test division to Cascade Microtech; forges alliance to address 3D TSV test

In a double-barreled press release, SUSS MicroTec announced the sale of its Test Systems Division to Cascade Microtech, Inc., a worldwide supplier of precise electrical measurement and test of integrated circuits; as well as a strategic partnership between the two companies to address the growing device complexities of emerging semiconductor technologies such as 3D TSV manufacturing and test. »

3D makes the test community “To Do” list

I just finished putting together a presentation for the upcoming BiTS Workshop March 7-10, 2010 taking place in my backyard in Mesa, AZ. »

Focus on 3D Design

Will this be the year for 3D IC design tools? Who knows for sure? But by the looks of the agendas of some upcoming design-centric events, 3D certainly seems to be on everyone’s mind. »

Leti and R3Logic collaborate to develop 3D design methodologies

Global research center, Leti, located in Grenoble France, and 3D IC EDA company R3Logic,announced that they will combine their expertise in 3D silicon integration and packaging. »

Exercise your inquisitive mind

This year, both my daughters joined the high school debate team. Team parents are asked to judge tournaments from time to time, so a few weeks ago, I spent a day as an official judge of ASU Southwest Championships, held at the Arizona State University campus. It was a high-level event, and I was blown away by the skill, poise, knowledge of topic, and delivery that these young adults displayed. »

Congratulations, Bob Patti!

This is way too big a deal to just post a press release about. When I read the news on the SEMI website, I decided a public kudos was much more appropriate, especially considering the wealth of knowledge Bob has been gracious enough to share with me since I started my blog a year ago. »

3D R&D Round-up: MIT Lincoln Labs works on SOI

At MIT Lincoln Labs (MITLL), R&D processes developing 3D chips using silicon-on-insulator (SOI) wafers is the sole focus. As Phil Garrou, Ph.D. »

Canon Marketing Japan: A Causeway to the Japanese Market

It’s no secret that Japan has its own ideas of how to do pretty much everything.  The culture is an interesting mix of ancient tradition, ceremony, modernization, and technological advancement.  The centuries-old Imperial Palace and grounds, home to the sitting Emperor, is surrounded by the steel-and-glass cosmopolitan city of Tokyo.  A complex, intricate, state-of-the-art public transp... »

TSV Seminar Looks Back to the Future of Etch

Attending last week’s TSV Seminar in Tokyo, hosted by Electronic Journal, posed a bit of a challenge as all but one presentation was in Japanese. However, thanks to the detailed diagrams and smatterings of English in the proceedings along with careful note taking by Tegal Corp.'s interpreter Yukumi Hayafune, I was able to summarize the main points of the event. But first, a word about the diffe... »

Bringing in the experts

It occurred to me recently that 3D InCites would benefit from having a technical advisory board. »