Archives August 2009 - 3D InCites

Bringing Transparency to 3D Integrated Structures – Olympus Confocal IR Microscopy

Metrology is consistently one of the more challenging areas in the semiconductor field. Whether it’s the monitoring of ultra-small features and defects, or inspecting the backside or bevel of a wafer, the challenges are ever growing. The situation is further complicated by the need for in-line metrology that can be used in the fab during device manufacturing as distinct from out-of-line failur... »

Was Moore’s Law really meant to be a law or more of a guideline?

Before I joined the semiconductor industry, I was completely unaware of this guy Gordon Moore, whose observations and predictions set in motion the course of computing hardware history, and with it the existence of all the consumer electronics that have become essential to everyday life. What I find most fascinating about this is the profound effect this theory has had on an entire world market. A... »

Georgia Tech’s Rao Tummala to deliver IWLPC Dinner Keynote

Trend and Progress from ICs to 3D ICs to 3D Systems-on-Wafer This year's IWLPC dinner keynote address will be delivered by Dr. Rao Tummala, Professor and Director of NSF ERC at Georgia Institute of Technology on Thursday, October 29, 6:30pm - 8:00pm. »

IMAPS Global Business Council Announces Fall Progam

Titled "Recovery of the Semiconductor Market.", IMAPS GBC will feature two guest speakers. Andrea Lati, market research analyst for VSLI, and Shawn DuBravac, director of research of the Consumer Electronics Association. Lati will discuss the overall state of the semiconductor industry, while DuBravac will share insight on the impact of consumer technologies on semiconductors. »

A*STAR and EDB launch 3D TSV consortium in Singapore

The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), launched a 3D through silicon via (TSV)consortium to boost next-generation 300mm wafer manufacturing capability and meet technology and product needs of the Singapore semiconductor industry. »

Inside CEA-Leti’s 3D Toolbox

Grenoble-based research institute CEA-Leti’s progress is fueled by a single mission: create innovation and transfer it to industry. The goal is to reach marketability within 5 years. As such, Leti’s focus is less on the feasibility of a technology, and more on the probability of that technology being viable in volume production. When it comes to 3D integration, achieving this goal has resulted... »

Investment in ALLVIA climbs to $25M

ALLVIA,  the first through-silicon via (TSV) foundry, reports it has secured $5M from private investors in its next round of funding to expand manufacturing facilities and to build more capacity. This brings the total funding invested in the company to $25M. »

SUSS MicroTec and Thin Materials Collaborate on Temp. Bonding Solution

 SUSS MicroTec and Thin Material cooperate on a temporary bonding process that simplifies the debond process by eliminating a number of steps thus saving time and lowering device costs.    »

3D InCites: Unveiled

Today, July 6, 2009, is the day a vision becomes a reality. When I first started Françoise in 3D, I knew it was just the beginning of something much bigger. »

Following the BrightSpots 3D IC Forum

Day One: I'm not sure if it’s because it was the Monday after a U.S. holiday weekend, or just a Monday, but things seemed a bit slow out of the gate. I posted the first questions and waited. Paul Lindner of EV Group jumped right in on a positive note, pointing out that 3D IC is moving from a purely R&D phase into the first level industrial phase. Bob Patti of Tezzaron concurred, saying t... »

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