Bringing Transparency to 3D Integrated Structures – Olympus Confocal IR Microscopy
Metrology is consistently one of the more challenging areas in the semiconductor field. Whether it’s the monitoring of ultra-small features and defects, or inspecting the backside or bevel of a wafer, the challenges are ever growing. The situation is further complicated by the need for in-line metrology that can be used in the fab during device manufacturing as distinct from out-of-line failur... »
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