Much has been written about the challenges that corporations face – especially established corporations – in adapting to a disruptive...
In a previous blog, I discussed a power design network’s (PDN) self and transfer impedances. Self impedance highlights anti-resonances causing a...
In the past year, I have written short pieces explaining how Path Finding methodology can proactively help identify viable solutions...
In previous posts, I discussed a process for process-centering a design. In this post, we will examine how non-robust design’s...
Like the previous 10 years, RTI International held the 11th 3D-IC focused conference in early December. Instead of the usual...
You might think this is crazy but bear with me for 421 words. Early in my career, I worked at...
Fruitful path finding eventually identifies solutions that are viable for mechanical, electrical, thermal, and cost (METC) requirements. Hopefully, more than one...
TechSearch International’s recently published 3D IC Gap Analysis report has a section for a new class of tools called Path...
Good news! At last week’s GSA 3D IC Packaging Working Group Meeting, July 23, 2014, Jan Vardaman uttered the words...
Microelectronic products all have mechanical, thermal and electrical properties that degrade until the device is permanently damaged. Path finding adds...
