3D IC designs

Executive Interview: Si2 Aims to Boost Confidence in Designing 3D ICs

Executive Interview: Si2 Aims to Boost Confidence in Designing 3D ICs

There’s no doubt left in the minds of semiconductor device manufacturers that the processes required to build interposer-based and 3D IC devices are matured and ready for production. However, the jury is still out in the design community because designing 3D ICs still poses a challenge. Si2 has set out to change that and bring confidence to the minds of chip and system-level designers. Steve Sc... »