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FOGALE Nanotech Group Subsidiary UnitySC Opens New Global Headquarters in Grenoble, France

FOGALE Nanotech Group Subsidiary UnitySC Opens New Global Headquarters in Grenoble, France

Grenoble, France – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced the opening of its global headquarters in Grenoble, France, the heart of the French Silicon Valley. This location strategically positions the company in one of Europe’s key semiconductor research and manufacturi... »

TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP

TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan-out WLP (FO-WLP). Driven by demand for thin, low-profile packages in smartphones, tablets, and wearable devices such as smart watches, fitness bands, and virtual reality headsets, fan-in WLPs are projected to have a >10% gr... »

Fan-out is the Most Dynamic IP Landscape in Advanced Packaging
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Fan-out is the Most Dynamic IP Landscape in Advanced Packaging

In the fast-growing fan-out market showing 80% increase between 2015 and 2017[1], it is today essential to deeply understand the patent strategies of the key players. The Technology Intelligence & Intellectual Property (IP) Strategy Company, KnowMade has thoroughly investigated the fan-out packaging patent landscape and releases today the new patent landscape analysis titled Fan-Out Wafer Leve... »

SiP Impact, Smartphone Market Saturation… What is the Future of Fan-in Packaging?
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SiP Impact, Smartphone Market Saturation… What is the Future of Fan-in Packaging?

Fan-in packaging has been a successful and steadily growing platform for over a decade. However, fan-in packaging should face a challenging future, announces Yole Développement (Yole), the “More than Moore” market research and strategy consulting company. Indeed, despite unchanged market drivers, Fan-In packaging is showing an uncertain future with a slowing down smartphone market and the gro... »

3D TSV IP Landscape for Memory Applications: Who Owns What?
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3D TSV IP Landscape for Memory Applications: Who Owns What?

The last two years have shown some important changes within the 3D through silicon via (TSV) memory market. First commercial products including 3D stacked (3DS), DDR4, high bandwidth memory (HBM) and hybrid memory cube (HMC) have been released by the microelectronics giants. Then first 3D TSV IP patent litigations took place between ELM 3DS and leaders such as Samsung Electronics, SK Hynix, and Mi... »

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