Francoise von Trapp (aka the Queen of 3D) has been following and reporting on the progress of 3D integration technologies since 2009. Francoise in 3D provides a high-level perspective of 3D industry events, offers executive viewpoints, and focuses on process and manufacturing aspects of 3D integration.
At last week’s International Microelectronics and Packaging Society’s Device Packaging Conference, (IMAPS DPC 2024) we didn’t need TrendForce to tell us that advanced packaging is the hottest technology in the semiconductor industry. We just needed to look at the record attendance of more than 700 advanced packaging enthusiasts who turned...
When I interview members for the 3D InCites Podcast at industry events, I often ask them, “What did you come here to learn?” As this is my first time at ISS Europe, I asked myself that question. Here’s what I came up with. I attended ISS Europe 2024 to learn...
It was an interesting year for the 2024 3D InCites Awards as we changed our processes, criteria, and categories to improve the program. We intended to provide more opportunities for participation across the heterogeneous integration supply chain, and we are happy with the outcome. A special thank you to the...
A Conversation About Leadership with SEMI CEO Ajit Manocha For the past few years, we’ve heard semiconductor market analysts prognosticate that based on estimated demand, semiconductors have the potential to become a $1Trillion industry in the next 7-10 years. This number is based on analysts’ projections of driving markets including...
As they do every year, semiconductor industry leaders gathered in Half Moon Bay, CA in early January for SEMI ISS 2024 to take stock of the economic trends and market drivers to set their corporate strategies for 2024. Appropriately, the weather outside the Ritz-Carlton, overlooking the Pacific Ocean, matched the...
2023 was a year of growth and change for 3D InCites, as well as me personally. In April, I left my role at Kiterocket and the security of a salary and benefits to follow my passion and focus full-time on supporting the 3D InCites Community. It was time, and I...
One of the best things about being headquartered in Phoenix, AZ is having a front-row seat of all the semiconductor industry growth that’s happening. Case in point: Last week (December 3-5) the city hosted one leg of a Netherlands-Flanders Economic Mission to the US that was sponsored by the Consulate...
At SEMICON Europa 2023, we heard more good news about 3D heterogeneous Integration from speakers at the CEO Summit and the Advanced Packaging Conference. Not only has it become the champion for the continuation of Moore’s Law scaling, but it also allows us to deliver on power performance area and...
In 2023, The International Microelectronics Packaging Society (IMAPS) reinvigorated its Arizona Chapter with monthly events at member sites. So far, I’ve attended lunch at Amkor Technology and more recently, Happy Hour at Deca Technologies. Each event started off with a technology presentation by the host company, followed by networking. In...
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics of the day. They shared their opinions on everything from the possibility of the U.S. onshoring advanced packaging technology in high volumes, to the impact of germanium and gallium restrictions...