Guest bloggers from across the supply chain and from various market segments contribute to provide insight on the implications of 3D integration technologies. Industry experts who have something to say are invited to participate.
As the company boasts some of the most advanced plasma equipment in the industry, CCO Peter Dijkstra discusses how Trymax Semiconductor Equipment B.V. (Trymax) has achieved this unique position. Amongst many titans of the semiconductor manufacturing industry in the Netherlands, Trymax Semiconductor Equipment B.V. (Trymax) is the company of choice...
Let’s catch up on what we missed among our community… Cadence completed the acquisition of the SerDes and memory interface PHY IP business from Rambus. At ISES EU Power in Italy, Dr. Stefan Pieper, Global Application Manager for Semiconductor, spoke about electroless metallization for power semiconductors and introduced MKS’ Atotech’s...
2024 marks the fourth year I will serve on the 3D InCites Sustainability Award judging panel. We want to recognize companies in our industry that are sustainability leaders. (In this blog post, when I say “sustainability leader” I’m referring to a company, not an individual within it.) The more often...
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This year’s symposium will feature five technical tracks, professional development courses and an interactive poster session. The technical program spans three days of sessions with emphasis on SiP/Design/Manufacturing Optimization; Wafer Level/Panel...
This interview with Trymax Semiconductor’s Peter Dijkstra, Chief Commercial Officer (CCO), and Karsten Arts, Process Engineer first appeared in Atomic Limits as part of a series of posts about companies within the atomic scale processing industry. The goal of the series was to provide information about the kind of products...
News you may not have seen this month from our community members. Along with some upcoming participation to keep an eye on. Onto Innovation announced over $100 Million in orders for systems supporting advanced packaging for AI. Its Dragonfly® G3 sub-micron inspection and metrology system supports production of AI chiplet packages....
Navigating Disruptions and Enhancing Semiconductor Supply Chain Resilience The COVID-19 pandemic exposed the complexity and fragility of our global supply network, highlighting the importance of resilient semiconductor supply chains and the need for strategic inventory management systems. Effective inventory management is critical to maintain a competitive edge in today’s fast-paced...
SEMICON Taiwan is arguably the most influential semiconductor event in Taiwan, reaching records high in terms of scale in its 27 years of history, attracting 700 exhibitors, using a total of 2,450 booths, and organizing more than 20 international forums. This year it will spotlight eight key industry themes: advanced...
Those of you who have been in the advanced packaging world for 20 years or more may recall the tremendous challenges in replacing eutectic tin/lead (Sn/Pb) solder with lead-free alternatives. Pb is an excellent alloying element. Its low melting point and ductility are ideally suited for solder joints. Unfortunately, as...
Lam Research announced quantifiable progress has been made toward its environmental, social and governance (ESG) goals with the release of its 2022 ESG report. Lam’s continued progress toward its ESG goals included exceeding its 2025 goals for water savings as well as surpassing its 2025 goal for employee volunteer hours, prompting...