A Technology and Applications Forum presented by Rudolph Technologies
Featuring guest speakers from local fabs, the Rudolph Yield Forum provides process engineers, fab managers and tool owners with new application data and process control techniques that address current process challenges. Experts will speak to current trends and applications for macro defect inspection, 3DIC inspection and metrology, probe card test and analysis, thin film metrology, advanced packaging lithography, yield management and process control techniques
Featuring Keynote Speaker from Lufthansa
Manfred Müller
General Manager Flight Safety
Increasing Safety by Implementing Optimized Team Interaction—Experiences of the Aviation Industry
Also featuring guest speakers from Bosch, Dynex, LETI, STM, XFAB and more!
Agenda Highlights
Wafer Processing (Front-End) Session
- TSV Inspection and Metrology
- Engineering Data Analysis at Bosch Reutlingen (Deployment of a Fabwide YMS)
- Fleet Management: Optimizing your Rudolph Inspection Systems
- Use of Image Clustering Methodology in Maximizing Defect Detection and Classification of Bare Wafer Edge and Back
- High Die Count Inspection
- Reducing Optical &SEM Review Costs with Automatic Defect Classification Software
- Metrology Challenges and Techniques for Gate Oxide Control at 1x and 2x Nodes
- Advanced 2D and 3D Membrane Metrology on NSX 115 and NSX 320
- Bulk Acoustic Metrology and Defect Inspection for Metal Structures
Final Manufacturing (Band-End) Session
- IGBT Inspection
- Lithography Challenges for 2.5D Interposers and Related Processes
- Bulk Acoustic Metrology and Defect Inspection for Metal Structures
- Advanced 2D and 3D Membrane Metrology on NSX 115 and NSX 320
- 3D Measurement for TSV, MEOL, RST and Temporary Bonding
- 3DI Process Characterization by Integrated Defectivity and Metrology
- A Comprehensive Solution for Post-saw Delamination including Reduced Review
- Thin Wafer and Taiko Handling
- Fleet Management: Optimizing your Rudolph Inspection Systems
*Agenda subject to change. Check website for updated agenda.
To register, visit www.RudolphTechnologies.com
For More Information:
Contact: Claire Cilip
Email: claire.cilip@rudolphtech.com
Tel: 952-259-1650
