SEMICON Taiwan 2015 celebrates it’s 20th year this year as the premier event in Taiwan for microelectronics manufacturing. Once again this year, the event will host the SiP Global Summit, a two-day event (September 3-4), with each day focused on 3D IC Technology and Embedded and Wafer Level Packaging Technology, respectively.
TSV has successfully created a new dimensional 3D interconnection in chip as key milestone of System in Package (SiP) interconnections.
While the entry barrier to 2.5D and 3D IC in device complexity, cost structure and technical challenges had gradually inspired many interesting alternative technologies such as simplified TSV wafer level package, aiming at providing more complete toolbox for SiP. SoC, together with SiP will continue to enrich the system integrating solutions.
This 3D Forum Summit will invite global pioneers and experts focusing on the development of flagship 3D IC and 2.5D IC packaging, reviewing TSV alternative solution, trying to shape outlook for the upcoming new era of TSV enabled microelectronics toward the bright future of both IoT and Cloud Computing applications. For the full agenda, visit the SIP Global Summit web page.
